Single-leg bending (SLB) analysis of a structural adhesive as a function of the adhesive thickness

Procedia Structural Integrity Pub Date : 2025-01-01 DOI:10.1016/j.prostr.2025.08.074

A.F.L. Macedo , R.D.S.G. Campilho , A.L. Faria , M. Belhouari , K. Madani

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引用次数: 0

Abstract

The mixed-mode static fracture analysis of bonded joints using cohesive zone models (CZM) requires accurate predictions of adhesive strength and fracture toughness. Tensile and shear fracture toughness (G_IC and G_IIC), along with their mixed-mode behaviors, significantly vary with the adhesive thickness (t_A). This work focuses on the numerical analysis of how t_A influences the mixed-mode fracture process in adhesive joints. Experimental data from single-leg bending (SLB) tests is used, involving composite adherends and a ductile adhesive, with t_A ranging from 0.1 to 2.0 mm. The study includes a comparison between experimental and numerical load-displacement (P-δ) curves for validation purposes, followed by the estimation of CZM laws and validation of the fracture envelope across all t_A. The findings enabled a comprehensive numerical evaluation of the t_A effect on fracture behavior in adhesive joints, leading to the proposal of a numerical methodology to analyze mixed-mode bonded joints.

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一种结构胶粘剂的单腿弯曲（SLB）随胶粘剂厚度的函数分析

利用黏合区模型（CZM）进行粘接接头的混合模式静态断裂分析，需要准确预测粘接强度和断裂韧性。拉伸和剪切断裂韧性（GIC和GIIC）及其混合模式行为随胶粘剂厚度（tA）显著变化。本文着重对tA对粘接接头混合模式断裂过程的影响进行了数值分析。使用单腿弯曲（SLB）试验的实验数据，包括复合粘合剂和韧性粘合剂，tA范围为0.1至2.0 mm。该研究包括比较实验和数值载荷-位移（P-δ）曲线以进行验证，然后估计CZM规律并验证所有tA的断裂包络。研究结果可以对tA对粘结接头断裂行为的影响进行全面的数值评估，从而提出了一种分析混合模式粘结接头的数值方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Procedia Structural Integrity

CiteScore

1.70

自引率

0.00%

发文量