Continuous 5-axis routing of syringe deposited conductive traces over topology optimized structures

IF 2 Q3 ENGINEERING, MANUFACTURING
Matthew Williams , Ashish Jacob , Guha Manogharan
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引用次数: 0

Abstract

Hybrid additive manufacturing can be troublesome when implementing new processes using existing hardware which makes this research field increasingly prominent. Even after the integration of crucial hardware components necessary for Hybrid AM, there is no suitable procedure capable of efficient toolpath planning of multi-material and multi-functional materials. Topology-optimized design would benefit from a planned process using hybrid manufacturing with simple electronics integration because of the need for optimized functional structures in the aerospace and automotive industries. This research takes multi-axis CNC toolpath strategies for syringe-deposited conductive inks over additively manufactured topology-optimized structures and uses a hybrid AM machine utilizing multiple tools for manufacturing curvilinear traces over the drone frame design. Process parameter configuration for machine hardware and CAM toolpath tolerancing with machine simulations are discussed in this paper. The ability to route conductive traces over topologically optimized structures has been studied and implemented using a 5-axis toolpath planning strategy. The challenge lies in the ability to deposit traces seamlessly across conformal surfaces. The study demonstrates that the manufactured traces were seamless with no breakages, and the measured resistances across the trenches varied between 53.5 and 134.04 Ω.
连续的5轴路线注射器沉积导电痕迹的拓扑优化结构
混合增材制造在使用现有硬件实施新工艺时可能会遇到麻烦,这使得该研究领域日益突出。即使在集成了混合增材制造所需的关键硬件部件之后,也没有合适的程序能够有效地规划多材料和多功能材料的刀具轨迹。由于航空航天和汽车行业需要优化的功能结构,拓扑优化设计将受益于使用混合制造和简单电子集成的计划过程。本研究采用多轴数控刀具路径策略,在增材制造的拓扑优化结构上沉积注射器导电油墨,并使用混合增材制造机器,利用多个工具在无人机框架设计上制造曲线轨迹。本文讨论了机床硬件的工艺参数配置和凸轮刀具轨迹公差。利用五轴刀具路径规划策略,研究并实现了在拓扑优化结构上布线导电轨迹的能力。挑战在于在保形表面上无缝沉积痕迹的能力。研究表明,制造的走线是无缝的,没有破损,测得的跨沟电阻在53.5到134.04 Ω之间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Manufacturing Letters
Manufacturing Letters Engineering-Industrial and Manufacturing Engineering
CiteScore
4.20
自引率
5.10%
发文量
192
审稿时长
60 days
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