Thermomechanical analysis of ultrasonically welded copper-magnesium sheets with Ni and Zn interlayers

IF 5.3 2区 工程技术 Q1 MECHANICS
Zeshan Abbas , Lun Zhao , Liya Li , Ming Li , He Shengli , Chenhui Zhang
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Abstract

This paper presents a thermo-mechanical analysis of ultrasonically welded Cu-Mg sheets with incorporation of Ni and Zn interlayers. The experimental and simulation methods were employed to investigate the thermal mechanisms during welding process. The analysis reveals the variation in interface temperatures, acoustic softening effects and heat fields related to plastic deformation. The accuracy of simulation model is validated through these findings. Microscopic analysis indicates that after 0.4 sec of welding, Ni interlayer on Mg sheet at the center of joint interface partially melts and forms a liquid phase. The average friction coefficient at the weld interface is approximately 0.5. The maximum temperature at the interface can exceed 600 °C and approach the melting point of welded sheets. Plastic deformation begins after 0.45 sec and occurs mainly at Mg sheet interface. The grain size of Mg alloy at interface in this experiment ranges from 4 to 5 μm which is notably finer than the average grain size of 20 μm observed in base materials. The distribution and intensity of deformation fields provide valuable insights into how the Ni and Zn interlayers influence the mechanical integrity and overall performance of weld. Ni interlayer significantly improves mechanical properties of Cu-Mg welded joints, achieving higher load-bearing capacity (7865 N vs. 3688 N), tensile strength (80.23 MPa to 1821.26 MPa vs. 885.15 MPa to 1318.05 MPa) and fracture resistance (8.23 MPa to 1350.55 MPa vs. 6.20 MPa to 350.48 MPa) compared to Zn interlayer.
带Ni和Zn夹层的铜镁片超声焊接的热力学分析
本文对含有Ni和Zn夹层的Cu-Mg超声焊接板进行了热力学分析。采用实验和仿真相结合的方法对焊接过程中的热机理进行了研究。分析揭示了界面温度的变化、声软化效应和热场与塑性变形的关系。通过这些发现验证了仿真模型的准确性。金相分析表明,焊接0.4秒后,连接界面中心Mg片上的Ni夹层部分熔化,形成液相。焊缝界面处的平均摩擦系数约为0.5。界面处的最高温度可超过600℃,接近焊接板的熔点。塑性变形在0.45秒后开始,主要发生在镁板界面处。镁合金在界面处的晶粒尺寸在4 ~ 5 μm之间,明显小于基材平均20 μm的晶粒尺寸。变形场的分布和强度为研究Ni和Zn夹层如何影响焊缝的机械完整性和整体性能提供了有价值的见解。与Zn夹层相比,Ni夹层显著改善了Cu-Mg焊接接头的力学性能,具有更高的承载能力(7865 N比3688 N)、抗拉强度(80.23 MPa ~ 1821.26 MPa比885.15 MPa ~ 1318.05 MPa)和抗断裂能力(8.23 MPa ~ 1350.55 MPa比6.20 MPa ~ 350.48 MPa)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
8.70
自引率
13.00%
发文量
606
审稿时长
74 days
期刊介绍: EFM covers a broad range of topics in fracture mechanics to be of interest and use to both researchers and practitioners. Contributions are welcome which address the fracture behavior of conventional engineering material systems as well as newly emerging material systems. Contributions on developments in the areas of mechanics and materials science strongly related to fracture mechanics are also welcome. Papers on fatigue are welcome if they treat the fatigue process using the methods of fracture mechanics.
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