Fabrication of multicomponent copolymer-derived fluorocarbon resin toward ultra-low dielectric loss

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2025-08-28 DOI:10.1016/j.matlet.2025.139401

Kaibin Huang , Pengcheng Wu , Hongsheng Luo , Qingqing Yuan , Shengtzung Chiang , Jentsung Lin , Yunsong Zhang , Fei Liang

引用次数: 0

Abstract

A fluorocarbon resin with a multicomponent copolymer was synthesized via free radical and cationic polymerization, with systematic comparison of their fabrication processes. The impact of fluorine content on fluorocarbon resin’s dielectric, mechanical and thermal properties was thoroughly investigated. The outcomes depicted that the resin exhibited outstanding dielectric performance at 10 GHz, mostly with a dielectric loss below 0.001. Thermal and mechanical tests manifested when the volume ratio of divinylbenzene to octafluoropentyl acrylate was 7:3, the glass transition temperature of the sample peaked (FPDO-2: 211.67°C, FCDO-2: 213.67°C), whereas toughness was maximized at 6:4 (FPDO-3: 11.1 MJ/m³, FCDO-3: 13.9 MJ/m³).

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面向超低介电损耗的多组分共聚物衍生氟碳树脂的制备

采用自由基聚合法和阳离子聚合法合成了一种多组分共聚物氟碳树脂，并对其制备工艺进行了系统比较。研究了氟含量对氟碳树脂介电性能、力学性能和热性能的影响。结果表明，该树脂在10 GHz下表现出优异的介电性能，大多数介电损耗低于0.001。热学和力学试验表明，当二乙烯基苯与丙烯酸辛氟戊酯的体积比为7:3时，样品的玻璃化转变温度达到峰值（FPDO-2: 211.67℃，FCDO-2: 213.67℃），而韧性在6:4时达到最大值（FPDO-3: 11.1 MJ/m3, FCDO-3: 13.9 MJ/m3）。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive