A new monolithic proportional gas detector with a micro-gap electron multiplier structure directly integrated on top of a finely pixelated readout ASIC

IF 1.4 3区 物理与天体物理 Q3 INSTRUMENTS & INSTRUMENTATION
C. Sgrò , L. Baldini , R. Bellazzini , A. Brez , M. Ceccanti , L. Latronico , L. Lucchesi , A. Manfreda , M. Minuti , L. Orsini , M. Pesce-Rollins , M. Pinchera , A. Profeti , G. Spandre
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Abstract

We describe the design and preliminary test of a new generation of Gas Pixel Detector where the amplification structure is built directly on top of a CMOS ASIC. In this concept the chip works at the same time as readout electronics, collection plane and electron multiplication structure. We use an ASIC from the XPOL family, successfully operating on-board the IXPE polarimetric and imaging space telescope. It comprises 100k 50μm pitch hexagonal pixels and a large area analog readout, combined with a very fine pitch 1-D or 2-D gas proportional charge amplifying structure based on the concept of the micro-gap chamber. The charge multiplier is built directly on the uppermost metal layer of the chip, i.e. on the metal pads which act as the charge collecting electrodes each connected to the input stage of their respective individual pre-amplifier. This is achieved by adding two thin (about 2μm thick) finely patterned layers, one insulator and one metal, as a post-processing micro-fabrication step. These three layers together constitute the anode-cathode gap of a micro-gap like charge multiplication structure. The goal is to exploit the intrinsic sub-micron precision of the process and the extremely small exposed dielectric material to improve the compactness, space and energy response uniformity and the gain stability over time. Preliminary tests validating this concept are discussed in this paper.
一种新型的单片比例气体探测器,其微间隙电子倍增器结构直接集成在精细像素读出ASIC之上
我们描述了新一代气体像素检测器的设计和初步测试,其中放大结构直接构建在CMOS ASIC上。在这个概念中,芯片与读出电子、采集平面和电子倍增结构同时工作。我们使用了XPOL系列的ASIC,成功地在IXPE偏振成像太空望远镜上运行。它包括100k 50μm间距的六边形像素和大面积模拟读出,结合基于微间隙室概念的非常精细间距的1-D或2-D气体比例电荷放大结构。电荷倍增器直接建立在芯片的最上层金属层上,即作为电荷收集电极的金属垫上,每个电极连接到各自的前置放大器的输入级。这是通过添加两个薄(约2μm厚)精细图案层,一个绝缘体和一个金属,作为后处理微加工步骤来实现的。这三层合在一起构成了一种类似微隙的电荷倍增结构的阳极-阴极隙。目标是利用该工艺固有的亚微米精度和极小的暴露介质材料来改善紧凑性,空间和能量响应均匀性以及增益随时间的稳定性。本文讨论了验证这一概念的初步试验。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
3.20
自引率
21.40%
发文量
787
审稿时长
1 months
期刊介绍: Section A of Nuclear Instruments and Methods in Physics Research publishes papers on design, manufacturing and performance of scientific instruments with an emphasis on large scale facilities. This includes the development of particle accelerators, ion sources, beam transport systems and target arrangements as well as the use of secondary phenomena such as synchrotron radiation and free electron lasers. It also includes all types of instrumentation for the detection and spectrometry of radiations from high energy processes and nuclear decays, as well as instrumentation for experiments at nuclear reactors. Specialized electronics for nuclear and other types of spectrometry as well as computerization of measurements and control systems in this area also find their place in the A section. Theoretical as well as experimental papers are accepted.
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