{"title":"A Low-Profile and Low-Noise 4 × 4 Tile-Type K-Band Receive Module Using 3D Stacked LTCC Technology","authors":"Weiwei Liu, Anxue Zhang, Shiqiao Zhang, Wenchao Chen","doi":"10.1049/ell2.70412","DOIUrl":null,"url":null,"abstract":"<p>This paper presents a low-profile K-band 4 × 4 tile-type receive module utilizing low temperature co-fired ceramic (LTCC) technology, achieving per-channel noise figure (NF) below 1.8 dB. The module architecture comprises a metallic shell, an LTCC components, a bottom cover plate, and four metallic fasteners. Three-dimensional monolithic integration is achieved through stacked circuitry, advanced processing, and fuzz button interconnects. Critical NF optimization (< 1.8 dB) results from co-designed LNA layer topology and fuzz button connector interfaces. Fabrication and testing demonstrate > 11.5 dB return loss, > 18.2 dB channel gain, < ± 8.5 phase error across 16 channels, < 1.8 dB NF, 8 mm profile height, and 1.18 g per-channel mass. This design enables scalable low-profile phased arrays with high G/T for satellite communication systems.</p>","PeriodicalId":11556,"journal":{"name":"Electronics Letters","volume":"61 1","pages":""},"PeriodicalIF":0.8000,"publicationDate":"2025-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ietresearch.onlinelibrary.wiley.com/doi/epdf/10.1049/ell2.70412","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronics Letters","FirstCategoryId":"5","ListUrlMain":"https://ietresearch.onlinelibrary.wiley.com/doi/10.1049/ell2.70412","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents a low-profile K-band 4 × 4 tile-type receive module utilizing low temperature co-fired ceramic (LTCC) technology, achieving per-channel noise figure (NF) below 1.8 dB. The module architecture comprises a metallic shell, an LTCC components, a bottom cover plate, and four metallic fasteners. Three-dimensional monolithic integration is achieved through stacked circuitry, advanced processing, and fuzz button interconnects. Critical NF optimization (< 1.8 dB) results from co-designed LNA layer topology and fuzz button connector interfaces. Fabrication and testing demonstrate > 11.5 dB return loss, > 18.2 dB channel gain, < ± 8.5 phase error across 16 channels, < 1.8 dB NF, 8 mm profile height, and 1.18 g per-channel mass. This design enables scalable low-profile phased arrays with high G/T for satellite communication systems.
期刊介绍：
Electronics Letters is an internationally renowned peer-reviewed rapid-communication journal that publishes short original research papers every two weeks. Its broad and interdisciplinary scope covers the latest developments in all electronic engineering related fields including communication, biomedical, optical and device technologies. Electronics Letters also provides further insight into some of the latest developments through special features and interviews.
Scope
As a journal at the forefront of its field, Electronics Letters publishes papers covering all themes of electronic and electrical engineering. The major themes of the journal are listed below.
Antennas and Propagation
Biomedical and Bioinspired Technologies, Signal Processing and Applications
Control Engineering
Electromagnetism: Theory, Materials and Devices
Electronic Circuits and Systems
Image, Video and Vision Processing and Applications
Information, Computing and Communications
Instrumentation and Measurement
Microwave Technology
Optical Communications
Photonics and Opto-Electronics
Power Electronics, Energy and Sustainability
Radar, Sonar and Navigation
Semiconductor Technology
Signal Processing
MIMO
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