The nonlinear transient thermoelastic analysis of functionally graded sandwich plates rested on partially elastic foundations

IF 5.4 2区工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY

Engineering Science and Technology-An International Journal-Jestech Pub Date : 2025-08-28 DOI:10.1016/j.jestch.2025.102174

Ngoc-Tu Do , Trung Thanh Tran , Quoc Hoa Pham , Vu Khac Trai

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引用次数: 0

Abstract

This paper presents a nonlinear transient thermoelastic analysis of functionally graded sandwich (FGSW) plates with a metal core and FGM skin layers resting on partially elastic foundations (p-EF). A refined first-order shear deformation theory (r-FSDT) combined with Kármán-type geometric nonlinearity is employed, formulated using a weak-form Q4 finite element. The study incorporates temperature conduction through the plate thickness and accounts for temperature-dependent material properties, capturing realistic thermal effects. The governing equations are derived via Hamilton’s principle and solved by the Newmark-β time integration method coupled with Newton–Raphson iteration. The proposed approach’s accuracy is verified against available benchmark solutions. The novelty of this work lies in systematically investigating the nonlinear transient response of FGSW plates under dynamic loading in the presence of p-EF, which has received limited attention in the literature. Furthermore, a detailed parametric study examines the effects of geometrical parameters, material properties, foundation characteristics, and boundary conditions (BCs) on the dynamic behavior of FGSW plates.

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部分弹性地基上功能梯度夹层板的非线性瞬态热弹性分析

本文对基于部分弹性地基（p-EF）的具有金属芯和FGM蒙皮层的功能梯度夹层板（FGSW）进行了非线性瞬态热弹性分析。采用一阶剪切变形理论（r-FSDT）结合Kármán-type几何非线性，采用弱形式Q4有限元公式。该研究结合了通过板厚度的温度传导，并考虑了与温度相关的材料特性，捕捉了真实的热效应。控制方程由Hamilton原理推导，采用Newmark-β时间积分法结合Newton-Raphson迭代法求解。通过现有的基准方案验证了该方法的准确性。这项工作的新颖之处在于系统地研究了在p-EF存在的动载荷下FGSW板的非线性瞬态响应，这在文献中得到了有限的关注。此外，详细的参数研究考察了几何参数、材料特性、基础特性和边界条件（bc）对FGSW板动态行为的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Engineering Science and Technology-An International Journal-Jestech Materials Science-Electronic, Optical and Magnetic Materials

CiteScore

11.20

自引率

3.50%

发文量

153

审稿时长

22 days

期刊介绍： Engineering Science and Technology, an International Journal (JESTECH) (formerly Technology), a peer-reviewed quarterly engineering journal, publishes both theoretical and experimental high quality papers of permanent interest, not previously published in journals, in the field of engineering and applied science which aims to promote the theory and practice of technology and engineering. In addition to peer-reviewed original research papers, the Editorial Board welcomes original research reports, state-of-the-art reviews and communications in the broadly defined field of engineering science and technology. The scope of JESTECH includes a wide spectrum of subjects including: -Electrical/Electronics and Computer Engineering (Biomedical Engineering and Instrumentation; Coding, Cryptography, and Information Protection; Communications, Networks, Mobile Computing and Distributed Systems; Compilers and Operating Systems; Computer Architecture, Parallel Processing, and Dependability; Computer Vision and Robotics; Control Theory; Electromagnetic Waves, Microwave Techniques and Antennas; Embedded Systems; Integrated Circuits, VLSI Design, Testing, and CAD; Microelectromechanical Systems; Microelectronics, and Electronic Devices and Circuits; Power, Energy and Energy Conversion Systems; Signal, Image, and Speech Processing) -Mechanical and Civil Engineering (Automotive Technologies; Biomechanics; Construction Materials; Design and Manufacturing; Dynamics and Control; Energy Generation, Utilization, Conversion, and Storage; Fluid Mechanics and Hydraulics; Heat and Mass Transfer; Micro-Nano Sciences; Renewable and Sustainable Energy Technologies; Robotics and Mechatronics; Solid Mechanics and Structure; Thermal Sciences) -Metallurgical and Materials Engineering (Advanced Materials Science; Biomaterials; Ceramic and Inorgnanic Materials; Electronic-Magnetic Materials; Energy and Environment; Materials Characterizastion; Metallurgy; Polymers and Nanocomposites)