Thermal performance enhancement in PCM heat sinks using novel conductivity techniques: a review

Abstract

Previous studies have shown that exceeding critical temperature thresholds is a major cause of electronic device failure. Despite extensive research, conventional heat sinks often struggle to manage high heat loads, motivating the development of novel active and passive cooling strategies. One promising approach is the integration of phase change materials (PCMs) into heat sinks to enhance heat dissipation. To further improve the thermal performance of PCM-based heat sinks, various thermal conductivity enhancers (TCEs)—including fins, three-dimensional structures, nanoparticles, nanoplatelets, metal foams, and structured porous materials (SPMs)—have been investigated individually and in combination. While embedded fins and regular structures can significantly improve performance, they often increase system weight, encouraging the use of lightweight alternatives such as foam fins, as well as hybrid designs that combine active and passive methods depending on thermal load intensity. Enhancing PCM conductivity through nanoparticles has also been explored, though issues such as supercooling and particle settling remain key challenges. This review systematically evaluates and compares recent advancements in TCEs for PCM-based heat sinks, with an emphasis on materials, structural innovations, and performance under various thermal conditions. By categorizing solutions according to design approach, effectiveness under different thermal loads, and practical applicability, this work identifies the most promising strategies and highlights critical research gaps. The findings aim to guide future developments, including the optimization of lightweight foam fins, the integration of multi-staging concepts, and the adoption of fixed nanoplatelets to mitigate sedimentation, ultimately enabling more efficient and reliable thermal management solutions.