{"title":"BTI Aging Analysis and Mitigation for Differential Input In-Memory Computing SRAMs","authors":"Christina Dilopoulou;Yiorgos Tsiatouhas","doi":"10.1109/TVLSI.2025.3585027","DOIUrl":null,"url":null,"abstract":"SRAM-based in-memory computing (IMC) is a promising approach to overcome the bottleneck of traditional Von Neumann architectures that suffer from data transfer delay and energy inefficiency. Aging phenomena and process variations are a serious reliability and lifetime concern that may impact SRAM-based IMC array architectures, similar to conventional SRAM arrays. Bias temperature instability (BTI) is a dominant aging mechanism that degrades transistor performance and negatively affects the analog nature of the IMC computations. In this work, we present a simulation framework for the joined analysis of aging and process variation influence on IMC reliable operation. We perform, through SPICE simulations, an extensive BTI aging analysis on differential input SRAM-based IMC array architectures under different operating conditions and considering process variations. The simulation results show a substantial impact of aging on their reliability. Furthermore, we present an aging mitigation technique to maintain reliability and extend the lifetime of these circuits. Aging mitigation is achieved by periodically reconfiguring the active current paths in the IMC cells, with negligible cost on throughput and power consumption. The simulation results show that up to 68% of the IMC circuits can lose accuracy after three operating years, depending on the operating conditions. The aging mitigation technique effectively reduces the percentage of circuits that lose accuracy by up to 72% and decreases their degradation rate, essentially extending by more than <inline-formula> <tex-math>$9.3\\times $ </tex-math></inline-formula> their reliable lifetime.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 9","pages":"2570-2579"},"PeriodicalIF":3.1000,"publicationDate":"2025-07-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11081941/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
SRAM-based in-memory computing (IMC) is a promising approach to overcome the bottleneck of traditional Von Neumann architectures that suffer from data transfer delay and energy inefficiency. Aging phenomena and process variations are a serious reliability and lifetime concern that may impact SRAM-based IMC array architectures, similar to conventional SRAM arrays. Bias temperature instability (BTI) is a dominant aging mechanism that degrades transistor performance and negatively affects the analog nature of the IMC computations. In this work, we present a simulation framework for the joined analysis of aging and process variation influence on IMC reliable operation. We perform, through SPICE simulations, an extensive BTI aging analysis on differential input SRAM-based IMC array architectures under different operating conditions and considering process variations. The simulation results show a substantial impact of aging on their reliability. Furthermore, we present an aging mitigation technique to maintain reliability and extend the lifetime of these circuits. Aging mitigation is achieved by periodically reconfiguring the active current paths in the IMC cells, with negligible cost on throughput and power consumption. The simulation results show that up to 68% of the IMC circuits can lose accuracy after three operating years, depending on the operating conditions. The aging mitigation technique effectively reduces the percentage of circuits that lose accuracy by up to 72% and decreases their degradation rate, essentially extending by more than $9.3\times $ their reliable lifetime.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.