{"title":"Enhancing Memory BIST With an Optimized RTL-BIST IP Core: A Low-Power, High-Fault-Coverage Approach","authors":"Ming-Yi Lin;Wei-Kuan Chiang;Chin-Hung Wang","doi":"10.1109/TVLSI.2025.3581296","DOIUrl":null,"url":null,"abstract":"The increasing density of static random access memory (SRAM) in modern system-on-chip (SoC) architectures has intensified the need for efficient built-in self-test (BIST) solutions to ensure fault detection and repair. This article presents an optimized register transfer level (RTL)-BIST intellectual property core (IP core) that integrates a novel March mSR+ algorithm, providing a low-power, high-fault-coverage approach to embedded memory testing. Developed using high-level synthesis (HLS), the proposed framework enhances test efficiency while minimizing hardware complexity. Experimental results on field-programmable gate array (FPGA) implementations demonstrate that the March mSR+ algorithm achieves an 88.89% fault coverage while reducing power consumption compared with conventional March-based testing methods. These findings validate the effectiveness of the RTL-BIST framework in improving memory reliability for artificial intelligence (AI), high-performance computing (HPC), and safety-critical applications.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 9","pages":"2556-2569"},"PeriodicalIF":3.1000,"publicationDate":"2025-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11053774/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
The increasing density of static random access memory (SRAM) in modern system-on-chip (SoC) architectures has intensified the need for efficient built-in self-test (BIST) solutions to ensure fault detection and repair. This article presents an optimized register transfer level (RTL)-BIST intellectual property core (IP core) that integrates a novel March mSR+ algorithm, providing a low-power, high-fault-coverage approach to embedded memory testing. Developed using high-level synthesis (HLS), the proposed framework enhances test efficiency while minimizing hardware complexity. Experimental results on field-programmable gate array (FPGA) implementations demonstrate that the March mSR+ algorithm achieves an 88.89% fault coverage while reducing power consumption compared with conventional March-based testing methods. These findings validate the effectiveness of the RTL-BIST framework in improving memory reliability for artificial intelligence (AI), high-performance computing (HPC), and safety-critical applications.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.