Kyeong Mi Kim , Dong Ki Hwang , Huijeong Park , Hyo Jeong Kim , Jeyoung Park , Dongyeop X Oh , Sung Bae Park , Hyeonyeol Jeon , Jun Mo Koo
{"title":"Composting a Sticky Problem: Synthesis and Degradation of Isosorbide-Derived Hot-Melt Adhesive","authors":"Kyeong Mi Kim , Dong Ki Hwang , Huijeong Park , Hyo Jeong Kim , Jeyoung Park , Dongyeop X Oh , Sung Bae Park , Hyeonyeol Jeon , Jun Mo Koo","doi":"10.1016/j.polymdegradstab.2025.111617","DOIUrl":null,"url":null,"abstract":"<div><div>The accumulation of nondegradable plastics in the environment exacerbates the severity of plastic pollution, and adhesives such as hot melts are no exception. In multilayer plastic products, hot-melt layers are inserted between plastic films to provide functionality and adhesion: however, these adhesives reduce the overall degradability of the product and adversely affect the physical and chemical biodegradation process, even if the underlying substrate is biodegradable. Given the wide range of its industrial applications, transitioning from petroleum-based hot-melt adhesive components to biomass-based alternatives that maintain adequate mechanical properties is essential. In this context, we introduce a novel biodegradable hot-melt adhesive system based on poly(1,4-cyclohexanedimethylene-co-isosorbide succinate-co-citrate) (PCISC), a complex polyester derived from isosorbide. This system incorporates biomass-derived monomers and demonstrates a high adhesion of 5.2 MPa, similar to that of conventional hot-melt adhesives. The structure of the PCISC with such a high adhesion is evaluated through rheological analysis, and the transition of the adhesive component upon curing is identified using two-dimensional correlation spectroscopy. The high adhesion is the result of a combination of factors, including the mobility of flexible components (1,4-cyclohexanedimethanol and succinic acid), the formation of a 3D network through crosslinking of rigid components (citric acid), and partial charge interactions between the oxygen-containing moieties in isosorbide and the substrate. Degradation and composting experiments using biodegradable poly(lactic acid) as a substrate demonstrate the potential of the PCISC as a successful alternative to conventional hot-melt adhesives.</div></div>","PeriodicalId":406,"journal":{"name":"Polymer Degradation and Stability","volume":"241 ","pages":"Article 111617"},"PeriodicalIF":7.4000,"publicationDate":"2025-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer Degradation and Stability","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S014139102500446X","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0
Abstract
The accumulation of nondegradable plastics in the environment exacerbates the severity of plastic pollution, and adhesives such as hot melts are no exception. In multilayer plastic products, hot-melt layers are inserted between plastic films to provide functionality and adhesion: however, these adhesives reduce the overall degradability of the product and adversely affect the physical and chemical biodegradation process, even if the underlying substrate is biodegradable. Given the wide range of its industrial applications, transitioning from petroleum-based hot-melt adhesive components to biomass-based alternatives that maintain adequate mechanical properties is essential. In this context, we introduce a novel biodegradable hot-melt adhesive system based on poly(1,4-cyclohexanedimethylene-co-isosorbide succinate-co-citrate) (PCISC), a complex polyester derived from isosorbide. This system incorporates biomass-derived monomers and demonstrates a high adhesion of 5.2 MPa, similar to that of conventional hot-melt adhesives. The structure of the PCISC with such a high adhesion is evaluated through rheological analysis, and the transition of the adhesive component upon curing is identified using two-dimensional correlation spectroscopy. The high adhesion is the result of a combination of factors, including the mobility of flexible components (1,4-cyclohexanedimethanol and succinic acid), the formation of a 3D network through crosslinking of rigid components (citric acid), and partial charge interactions between the oxygen-containing moieties in isosorbide and the substrate. Degradation and composting experiments using biodegradable poly(lactic acid) as a substrate demonstrate the potential of the PCISC as a successful alternative to conventional hot-melt adhesives.
期刊介绍:
Polymer Degradation and Stability deals with the degradation reactions and their control which are a major preoccupation of practitioners of the many and diverse aspects of modern polymer technology.
Deteriorative reactions occur during processing, when polymers are subjected to heat, oxygen and mechanical stress, and during the useful life of the materials when oxygen and sunlight are the most important degradative agencies. In more specialised applications, degradation may be induced by high energy radiation, ozone, atmospheric pollutants, mechanical stress, biological action, hydrolysis and many other influences. The mechanisms of these reactions and stabilisation processes must be understood if the technology and application of polymers are to continue to advance. The reporting of investigations of this kind is therefore a major function of this journal.
However there are also new developments in polymer technology in which degradation processes find positive applications. For example, photodegradable plastics are now available, the recycling of polymeric products will become increasingly important, degradation and combustion studies are involved in the definition of the fire hazards which are associated with polymeric materials and the microelectronics industry is vitally dependent upon polymer degradation in the manufacture of its circuitry. Polymer properties may also be improved by processes like curing and grafting, the chemistry of which can be closely related to that which causes physical deterioration in other circumstances.