{"title":"Effects of Ti3AlC2 on the Microstructure, Hardness, and Corrosion Resistance of Sn-58Bi-0.075GNSs Solder Alloy","authors":"Dongliang Ma, Zhiyuan Liu, Jialin Wang, Xin Zheng","doi":"10.1007/s11837-025-07532-7","DOIUrl":null,"url":null,"abstract":"<div><p>This study investigated the effect of adding Ti<sub>3</sub>AlC<sub>2</sub> to composite solders consisting of Sn-58Bi-0.075GNSs. Different weight percentages (x = 0 wt.%, 0.25 wt.%, 0.5 wt.%, 0.75 wt.%, and 1.0 wt.%) of Ti<sub>3</sub>AlC<sub>2</sub> were incorporated into the solder composites. The results showed that adding 0.5 wt.% Ti<sub>3</sub>AlC<sub>2</sub> led to the most significant grain size refinement, reducing the average Bi phase intercept length by 55% compared to the Sn-58Bi-0.075GNSs solder. Ti<sub>3</sub>AlC<sub>2</sub> acted as a nucleation site for the Bi-rich phase during solder solidification, preventing coarsening. It also formed a second phase along the grain boundaries, enhancing both grain refinement-strengthening and dispersion-strengthening mechanisms. Furthermore, the addition of 0.5 wt.% Ti<sub>3</sub>AlC<sub>2</sub> resulted in the highest solder hardness, which was 6.2% greater than that of the Sn-58Bi-0.075GNSs solder. The Sn-58Bi-0.075GNSs-0.5Ti<sub>3</sub>AlC<sub>2</sub> composite exhibited superior corrosion resistance, forming a dense passive film on the corroded surface.</p></div>","PeriodicalId":605,"journal":{"name":"JOM","volume":"77 9","pages":"6577 - 6589"},"PeriodicalIF":2.3000,"publicationDate":"2025-07-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"JOM","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s11837-025-07532-7","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
This study investigated the effect of adding Ti3AlC2 to composite solders consisting of Sn-58Bi-0.075GNSs. Different weight percentages (x = 0 wt.%, 0.25 wt.%, 0.5 wt.%, 0.75 wt.%, and 1.0 wt.%) of Ti3AlC2 were incorporated into the solder composites. The results showed that adding 0.5 wt.% Ti3AlC2 led to the most significant grain size refinement, reducing the average Bi phase intercept length by 55% compared to the Sn-58Bi-0.075GNSs solder. Ti3AlC2 acted as a nucleation site for the Bi-rich phase during solder solidification, preventing coarsening. It also formed a second phase along the grain boundaries, enhancing both grain refinement-strengthening and dispersion-strengthening mechanisms. Furthermore, the addition of 0.5 wt.% Ti3AlC2 resulted in the highest solder hardness, which was 6.2% greater than that of the Sn-58Bi-0.075GNSs solder. The Sn-58Bi-0.075GNSs-0.5Ti3AlC2 composite exhibited superior corrosion resistance, forming a dense passive film on the corroded surface.
期刊介绍:
JOM is a technical journal devoted to exploring the many aspects of materials science and engineering. JOM reports scholarly work that explores the state-of-the-art processing, fabrication, design, and application of metals, ceramics, plastics, composites, and other materials. In pursuing this goal, JOM strives to balance the interests of the laboratory and the marketplace by reporting academic, industrial, and government-sponsored work from around the world.