Shilong Yang , Linna Zhao , Xiaofeng Gu , Wai Tung Ng
{"title":"An artificial neural network based electro-thermal behavioral model for SiC MOSFETs operating under wide temperature range and short-circuit condition","authors":"Shilong Yang , Linna Zhao , Xiaofeng Gu , Wai Tung Ng","doi":"10.1016/j.mejo.2025.106836","DOIUrl":null,"url":null,"abstract":"<div><div>To predict the switching behaviors of SiC MOSFETs in complex circuit systems, a hybrid modeling method combining an artificial neural network (ANN)-based electrical model with a thermal network model is proposed. The proposed ANN-based electrical model is trained using drain current (<em>I</em><sub>DS</sub>) measurements obtained from single-pulse short-circuit (SC) tests under high drain-source voltage (<em>V</em><sub>DS</sub>) conditions to improve transient simulation accuracy. Through comprehensive comparison between simulation and experimental results, the proposed ANN-based electrical model achieves dynamic parameter errors ranging from 0.63 % to 18.9 % across a wide temperature range (25–100 °C), achieved by optimized network topology, weights, and bias selection. Furthermore, the proposed hybrid model enables transient behavior prediction under extreme SC conditions, achieving errors between simulated and measured peak SC currents ranging from 1.22 % to 9.9 %. Furthermore, validation tests conducted at 100 °C and 125 °C confirm the model's reliable temperature prediction performance, with all dynamic parameter errors remaining below 13.2 % at 100 °C and 41.65 % at 125 °C, respectively.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"165 ","pages":"Article 106836"},"PeriodicalIF":1.9000,"publicationDate":"2025-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239125002851","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
To predict the switching behaviors of SiC MOSFETs in complex circuit systems, a hybrid modeling method combining an artificial neural network (ANN)-based electrical model with a thermal network model is proposed. The proposed ANN-based electrical model is trained using drain current (IDS) measurements obtained from single-pulse short-circuit (SC) tests under high drain-source voltage (VDS) conditions to improve transient simulation accuracy. Through comprehensive comparison between simulation and experimental results, the proposed ANN-based electrical model achieves dynamic parameter errors ranging from 0.63 % to 18.9 % across a wide temperature range (25–100 °C), achieved by optimized network topology, weights, and bias selection. Furthermore, the proposed hybrid model enables transient behavior prediction under extreme SC conditions, achieving errors between simulated and measured peak SC currents ranging from 1.22 % to 9.9 %. Furthermore, validation tests conducted at 100 °C and 125 °C confirm the model's reliable temperature prediction performance, with all dynamic parameter errors remaining below 13.2 % at 100 °C and 41.65 % at 125 °C, respectively.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.