Systematic shape optimization of manifold microchannel heat sinks for enhanced thermal-hydraulic performance

Abstract

Addressing the thermal management challenges of high-power electronics and energy efficiency limitations in heat sinks, this study proposes a systematic optimization strategy employing adjoint sensitivity analysis to enhance manifold microchannel heat sink (MMCHS) performance. Numerical investigations reveal that optimized the tapered manifold reduces thermal resistance by 40%, yet persistent coolant maldistribution and excessive pressure drop remain. By employing the adjoint method to optimize the manifold shape, the distribution uniformity of coolant is significantly improved, with a further 20% reduction in pressure drop. Subsequent collaborative optimization of the inlet plenum achieves a 21% reduction in pressure drop while maintaining flow distribution uniformity. The optimized MMCHS demonstrates unprecedented cooling efficiency, dissipating 1000 W/cm² heat flux with merely 0.02 W pumping power at a maximum solid temperature rise of 70.9 K, corresponding to the cooling coefficient of performance (COP) of 14,500. This advancement provides a novel strategy for ultra-low energy consumption thermal management of high heat flux electronic devices, while achieving a unification of exceptional performance and manufacturing feasibility.