{"title":"In-situ non-contact monitoring of photoresist thickness and degree of cure using terahertz time-domain spectroscopy","authors":"Sang-Il Kim , Hak-Sung Kim","doi":"10.1016/j.ndteint.2025.103530","DOIUrl":null,"url":null,"abstract":"<div><div>In this work, a terahertz time-domain spectroscopy (THz-TDS) system was used to measure the thickness and refractive index of the photoresist during the photolithography process. The THz-TDS system was configured in a reflection mode to inspect the photoresist. The time-domain THz waves reflected from the photoresist were analyzed in the frequency-domain using a Fourier transform. The amplitude and phase information of the frequency-domain THz waves were expressed as functions of the photoresist's thickness and refractive index using Fresnel equations. Numerical analysis was used to simultaneously determine the thickness and refractive index of the photoresist. The measurements obtained by the THz-TDS system were compared with spectroscopic ellipsometry, white light reflectance spectroscopy (WLRS), and scanning electron microscopy (SEM). The thickness and degree of curing of the photoresist were monitored in real time without contact, with a final-stage thickness difference of 12.3 % and a Pearson correlation coefficient up to 0.72 between THz monitoring and conventional methods.</div></div>","PeriodicalId":18868,"journal":{"name":"Ndt & E International","volume":"157 ","pages":"Article 103530"},"PeriodicalIF":4.5000,"publicationDate":"2025-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ndt & E International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0963869525002117","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, a terahertz time-domain spectroscopy (THz-TDS) system was used to measure the thickness and refractive index of the photoresist during the photolithography process. The THz-TDS system was configured in a reflection mode to inspect the photoresist. The time-domain THz waves reflected from the photoresist were analyzed in the frequency-domain using a Fourier transform. The amplitude and phase information of the frequency-domain THz waves were expressed as functions of the photoresist's thickness and refractive index using Fresnel equations. Numerical analysis was used to simultaneously determine the thickness and refractive index of the photoresist. The measurements obtained by the THz-TDS system were compared with spectroscopic ellipsometry, white light reflectance spectroscopy (WLRS), and scanning electron microscopy (SEM). The thickness and degree of curing of the photoresist were monitored in real time without contact, with a final-stage thickness difference of 12.3 % and a Pearson correlation coefficient up to 0.72 between THz monitoring and conventional methods.
期刊介绍:
NDT&E international publishes peer-reviewed results of original research and development in all categories of the fields of nondestructive testing and evaluation including ultrasonics, electromagnetics, radiography, optical and thermal methods. In addition to traditional NDE topics, the emerging technology area of inspection of civil structures and materials is also emphasized. The journal publishes original papers on research and development of new inspection techniques and methods, as well as on novel and innovative applications of established methods. Papers on NDE sensors and their applications both for inspection and process control, as well as papers describing novel NDE systems for structural health monitoring and their performance in industrial settings are also considered. Other regular features include international news, new equipment and a calendar of forthcoming worldwide meetings. This journal is listed in Current Contents.