Multifunctional Characteristics of Cu/Zn Co-Doped Hydroxyapatite: Enhanced Electrical, Surface, and Biocompatibility

IF 3.9 3区 医学 Q2 ENGINEERING, BIOMEDICAL
M. Durga Ganesh, Mukesh Kumar Manickasamy, P. Joel, Dasari Kalyani, Ajaikumar B. Kunnumakkara, Pamu Dobbidi
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Abstract

Developing multifunctional biomaterials with both electrical and biological properties is crucial for next-generation biomedical platforms. This study looks into how Cu/Zn co-doping affects the structural, electrical, and biological performance of hydroxyapatite (Ca10-x-yZnxCuy(PO4)6(OH)2; x = y = 0.2–1.2), which was synthesized through a solid-state reaction. Among the samples, the CZ6 composition (x = y = 0.6) showed the best properties. It had a single-phase hexagonal structure, a nanoscale crystallite size of about 32 nm, a d-spacing of 0.27 nm along the (112) plane, and a grain size that ranged from 300 to 1200 nm while still keeping the proper composition. Electrical tests showed that CZ6 had the highest dielectric constant of 14.06 at 1 MHz. It maintained a low and stable loss tangent (~0.01), lower grain boundary resistance, and improved AC conductivity (from 10−7 to 10−6 S/cm), indicating better charge transport. These electrical enhancements correlate strongly with improved biological responses. CZ6 displayed strong apatite formation in simulated body fluid, the highest BSA protein adsorption of 25.05 μg/mL, and an optimized zeta potential of −30.54 mV, which facilitates enhanced biomolecular interactions. Cytocompatibility tests with PSVK-1 (skin keratinocytes) and Wi-38 (lung fibroblasts) confirmed that cell viability remained high at all concentrations. While higher levels of dopants led to the formation of secondary phases and diminished biological responses, CZ6 kept a good balance between electroactivity and biofunctionality. These findings make CZ6 a promising electroactive bioceramic for bone tissue engineering, smart implant coatings, and bioelectret scaffolds, where combining electrical responsiveness with cellular compatibility is important.

Cu/Zn共掺杂羟基磷灰石的多功能特性:增强电、表面和生物相容性
开发具有电学和生物学特性的多功能生物材料对于下一代生物医学平台至关重要。本研究着眼于Cu/Zn共掺杂如何影响羟基磷灰石(Ca10-x-yZnxCuy(PO4)6(OH)2)的结构、电学和生物学性能;X = y = 0.2-1.2),通过固相反应合成。其中,CZ6组分(x = y = 0.6)的性能最好。它具有单相六方结构,纳米级晶粒尺寸约为32 nm,沿(112)平面的d-间距为0.27 nm,晶粒尺寸在300 ~ 1200 nm之间,但仍保持适当的成分。电学试验表明,在1 MHz时,CZ6的介电常数最高,为14.06。该材料具有较低且稳定的正切损耗(~0.01)、较低的晶界电阻和较高的交流电导率(从10−7 S/cm提高到10−6 S/cm),表明其具有较好的电荷输运性能。这些电增强与生物反应的改善密切相关。CZ6在模拟体液中具有较强的磷灰石形成能力,对BSA蛋白的最高吸附量为25.05 μg/mL, zeta电位为- 30.54 mV,有利于增强生物分子相互作用。PSVK-1(皮肤角质形成细胞)和Wi-38(肺成纤维细胞)的细胞相容性试验证实,在所有浓度下,细胞活力都保持在较高水平。虽然较高的掺杂水平会导致二次相的形成和生物反应的减弱,但CZ6在电活性和生物功能之间保持了良好的平衡。这些发现使CZ6成为一种很有前途的电活性生物陶瓷,可用于骨组织工程、智能植入涂层和生物驻极体支架,在这些领域,结合电响应性和细胞相容性是很重要的。
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来源期刊
Journal of biomedical materials research. Part A
Journal of biomedical materials research. Part A 工程技术-材料科学:生物材料
CiteScore
10.40
自引率
2.00%
发文量
135
审稿时长
3.6 months
期刊介绍: The Journal of Biomedical Materials Research Part A is an international, interdisciplinary, English-language publication of original contributions concerning studies of the preparation, performance, and evaluation of biomaterials; the chemical, physical, toxicological, and mechanical behavior of materials in physiological environments; and the response of blood and tissues to biomaterials. The Journal publishes peer-reviewed articles on all relevant biomaterial topics including the science and technology of alloys,polymers, ceramics, and reprocessed animal and human tissues in surgery,dentistry, artificial organs, and other medical devices. The Journal also publishes articles in interdisciplinary areas such as tissue engineering and controlled release technology where biomaterials play a significant role in the performance of the medical device. The Journal of Biomedical Materials Research is the official journal of the Society for Biomaterials (USA), the Japanese Society for Biomaterials, the Australasian Society for Biomaterials, and the Korean Society for Biomaterials. Articles are welcomed from all scientists. Membership in the Society for Biomaterials is not a prerequisite for submission.
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