Thermal annealing effects on the interaction between chromium and silicon carbide in a vacuum environment

T.T. Thabethe , U. Dockrat , T.B. Mashabela , T.B. Kadi , M.N. Mirzayev , G.T. Imanova , E. Demir , C. Maepa
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Abstract

This study examines the morphological, structural, and chemical changes in Cr thin films deposited on SiC substrates and subjected to vacuum annealing at 700 °C, 800 °C, and 900 °C for 2 h. Cr thin films, approximately 250 nm thick, were deposited using the e-beam deposition technique. Post-annealing, additional phases, including chromium carbides and chromium oxides were identified, while Cr3Si persisted as a stable phase across all temperatures. Morphological analysis showed that the as-deposited films were characterized by a uniform surface with finely distributed granules. Annealing at 700 °C increased grain size while retaining surface homogeneity. At 800 °C and 900 °C, the films exhibited significant grain growth and surface roughening, with the roughness increasing from 1.63 nm (as-deposited) to 13.8 nm at 900 °C. Additionally, localized segregation and nonhomogeneous surface features emerged at higher temperatures. XRD analysis revealed lattice expansion in the SiC substrate after annealing, indicating structural changes driven by thermal effects. The study highlights the influence of annealing on phase transformations, surface morphology, and structural integrity in Cr/SiC systems. These findings provide a deeper understanding of the thermal behavior of Cr/SiC composites, which is critical for optimizing their performance in high-temperature applications.
真空环境下热退火对铬与碳化硅相互作用的影响
本研究考察了沉积在SiC衬底上的Cr薄膜在700°C、800°C和900°C真空退火2小时后的形态、结构和化学变化。采用电子束沉积技术沉积了约250 nm厚的Cr薄膜。退火后,发现了其他相,包括碳化铬和氧化铬,而Cr3Si在所有温度下都保持稳定相。形貌分析表明,沉积膜表面均匀,颗粒分布均匀。在700℃退火时晶粒尺寸增大,同时保持表面均匀性。在800°C和900°C温度下,薄膜呈现出明显的晶粒生长和表面粗糙度,粗糙度从1.63 nm(沉积态)增加到900°C时的13.8 nm。此外,在较高温度下,局部偏析和非均匀表面特征出现。XRD分析显示,SiC衬底在退火后出现晶格膨胀,表明热效应导致了结构的变化。该研究强调了退火对Cr/SiC体系相变、表面形貌和结构完整性的影响。这些发现提供了对Cr/SiC复合材料热行为的更深入了解,这对于优化其在高温应用中的性能至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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CiteScore
5.30
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