Safety analysis of 55 kA high-temperature superconducting current lead under cooling loss condition

IF 2.1 3区工程技术 Q3 PHYSICS, APPLIED

Cryogenics Pub Date : 2025-08-12 DOI:10.1016/j.cryogenics.2025.104167

Hu Cheng , Kejie Wang , Shuangsong Du , Ke Zhang , Kaiming Jing , Kaizhong Ding , Yujun Dong

{"title":"Safety analysis of 55 kA high-temperature superconducting current lead under cooling loss condition","authors":"Hu Cheng , Kejie Wang , Shuangsong Du , Ke Zhang , Kaiming Jing , Kaizhong Ding , Yujun Dong","doi":"10.1016/j.cryogenics.2025.104167","DOIUrl":null,"url":null,"abstract":"<div><div>This paper presents a safety analysis of high-temperature superconducting (HTS) current leads under cooling failure conditions using fundamental heat transfer principles. The HTS section of the lead employs Bi-2223/Ag-Au superconducting material as the current-carrying medium. By utilizing ANSYS software’s steady-state and transient heat transfer capabilities, an axisymmetric design was developed at a 1/90 scale of a 55-kA current lead. This scaled model indirectly reflects performance parameters while reducing experimental costs and technical complexity. Analysis results indicate a Loss of Flow Accident (LOFA) time of 560 s and an overheating time of 45 s under steady-state current conditions. Temperature-displacement relationships under different deformation degrees were also established. When temperature reaches approximately 500 K, the hotspot locates at 70 % of the lead length with a 3.8 mm deformation. Experimental test data validated the feasibility of this method, providing a reference for subsequent testing.</div></div>","PeriodicalId":10812,"journal":{"name":"Cryogenics","volume":"151 ","pages":"Article 104167"},"PeriodicalIF":2.1000,"publicationDate":"2025-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Cryogenics","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0011227525001468","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}

引用次数: 0

Abstract

This paper presents a safety analysis of high-temperature superconducting (HTS) current leads under cooling failure conditions using fundamental heat transfer principles. The HTS section of the lead employs Bi-2223/Ag-Au superconducting material as the current-carrying medium. By utilizing ANSYS software’s steady-state and transient heat transfer capabilities, an axisymmetric design was developed at a 1/90 scale of a 55-kA current lead. This scaled model indirectly reflects performance parameters while reducing experimental costs and technical complexity. Analysis results indicate a Loss of Flow Accident (LOFA) time of 560 s and an overheating time of 45 s under steady-state current conditions. Temperature-displacement relationships under different deformation degrees were also established. When temperature reaches approximately 500 K, the hotspot locates at 70 % of the lead length with a 3.8 mm deformation. Experimental test data validated the feasibility of this method, providing a reference for subsequent testing.

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冷却损耗条件下55ka高温超导电流引线的安全性分析

本文应用基本传热原理对高温超导引线在冷却失效条件下的安全性进行了分析。引线的高温超导部分采用Bi-2223/Ag-Au超导材料作为载流介质。利用ANSYS软件的稳态和瞬态传热能力，在55 ka电流引线的1/90比例下开发了轴对称设计。该比例模型间接反映了性能参数，同时降低了实验成本和技术复杂性。分析结果表明，在稳态电流条件下，失流事故时间为560s，过热时间为45s。建立了不同变形程度下的温度-位移关系。当温度达到约500 K时，热点位于引线长度的70%处，变形量为3.8 mm。实验测试数据验证了该方法的可行性，为后续测试提供了参考。

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来源期刊

Cryogenics 物理-热力学

CiteScore

3.80

自引率

9.50%

发文量

审稿时长

2.1 months

期刊介绍： Cryogenics is the world''s leading journal focusing on all aspects of cryoengineering and cryogenics. Papers published in Cryogenics cover a wide variety of subjects in low temperature engineering and research. Among the areas covered are: - Applications of superconductivity: magnets, electronics, devices - Superconductors and their properties - Properties of materials: metals, alloys, composites, polymers, insulations - New applications of cryogenic technology to processes, devices, machinery - Refrigeration and liquefaction technology - Thermodynamics - Fluid properties and fluid mechanics - Heat transfer - Thermometry and measurement science - Cryogenics in medicine - Cryoelectronics