Effects of packing powder on densification and properties of pressureless sintered silicon nitride ceramics

IF 2.3 4区材料科学 Q2 MATERIALS SCIENCE, CERAMICS

International Journal of Applied Ceramic Technology Pub Date : 2025-06-10 DOI:10.1111/ijac.70001

You Zhou, Yuki Nakashima, Kiyoshi Hirao, Manabu Fukushima

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Abstract

Pressureless sintering of Si₃N₄ doped with 2 mol% Y₂O₃ and 5 mol% MgO was carried out at temperatures ranging from 1700°C to 1770°C in three kinds of packing powders consisting of Si₃N₄ and BN coupled with or without addition of Y₂O₃, MgO, and SiO₂. Effects of packing powders on weight change, densification, and grain growth during sintering and properties (thermal conductivity, fracture toughness, and bending strength) of the sintered samples were studied. It was found that adding Y₂O₃ and MgO into the packing powder resulted in improvement of densification, grain growth, thermal conductivity, fracture toughness, and bending strength of the sintered samples. However, further addition of SiO₂ into the packing powder could lead to suppressed grain growth and decrease in thermal conductivity, fracture toughness, and bending strength. The sample sintered at 1770°C in the packing powder containing Y₂O₃ and MgO was fully densified, and it possessed well-balanced properties: thermal conductivity of 76 W m⁻¹ K⁻¹, fracture toughness of 7.82 MPa m^1/2, and bending strength of 932 MPa.

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填料粉末对无压烧结氮化硅陶瓷致密化及性能的影响

在1700 ~ 1770℃的温度范围内，对掺杂2mol % Y2O3和5mol % MgO的Si3N4进行了无压烧结，制备了由Si3N4和BN组成的三种填料粉，分别添加或不添加Y2O3、MgO和SiO2。研究了填料粉对烧结过程中重量变化、致密化和晶粒生长的影响，以及烧结试样的导热系数、断裂韧性和抗弯强度等性能的影响。结果表明，在填料粉中添加Y2O3和MgO可改善烧结试样的致密化、晶粒生长、热导率、断裂韧性和抗弯强度。然而，在填料粉中进一步添加SiO2会抑制晶粒生长，降低导热系数、断裂韧性和抗弯强度。在含Y2O3和MgO的填料粉中，在1770℃烧结得到了致密化的试样，其导热系数为76 W m−1 K−1，断裂韧性为7.82 MPa m1/2，抗弯强度为932 MPa。

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来源期刊

International Journal of Applied Ceramic Technology 工程技术-材料科学：硅酸盐

CiteScore

3.90

自引率

9.50%

发文量

280

审稿时长

4.5 months

期刊介绍： The International Journal of Applied Ceramic Technology publishes cutting edge applied research and development work focused on commercialization of engineered ceramics, products and processes. The publication also explores the barriers to commercialization, design and testing, environmental health issues, international standardization activities, databases, and cost models. Designed to get high quality information to end-users quickly, the peer process is led by an editorial board of experts from industry, government, and universities. Each issue focuses on a high-interest, high-impact topic plus includes a range of papers detailing applications of ceramics. Papers on all aspects of applied ceramics are welcome including those in the following areas: Nanotechnology applications; Ceramic Armor; Ceramic and Technology for Energy Applications (e.g., Fuel Cells, Batteries, Solar, Thermoelectric, and HT Superconductors); Ceramic Matrix Composites; Functional Materials; Thermal and Environmental Barrier Coatings; Bioceramic Applications; Green Manufacturing; Ceramic Processing; Glass Technology; Fiber optics; Ceramics in Environmental Applications; Ceramics in Electronic, Photonic and Magnetic Applications;