Taejun Park, Jiyeon Cho, Sohee John Yoon and Yong-Lae Park*,
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引用次数: 0
Abstract
Integration of soft silicone materials through bonding is essential for the fabrication of soft robots and stretchable electronics. However, bonding of soft silicones is dependent on limited methods that compromise softness, structural integrity, and process simplicity. While plasma bonding is a fast and robust bonding method that overcomes these problems, it is limited to relatively rigid silicones, such as polydimethylsiloxane (PDMS). In this work, we propose a method for robust bonding of soft silicones through a simple and rapid process by introducing water to a plasma treatment. We found that water plasma bonding requires a short treatment time under 100 s to activate the surfaces and achieves interfacial toughness greater than 1,000 J m–2 within 3 min of bonding. We demonstrate the potential of the proposed method through multiple applications in which the rapidness, robustness, and increased versatility in the choice of materials allow novel and efficient modes of fabricating soft devices.
期刊介绍:
ACS Materials Letters is a journal that publishes high-quality and urgent papers at the forefront of fundamental and applied research in the field of materials science. It aims to bridge the gap between materials and other disciplines such as chemistry, engineering, and biology. The journal encourages multidisciplinary and innovative research that addresses global challenges. Papers submitted to ACS Materials Letters should clearly demonstrate the need for rapid disclosure of key results. The journal is interested in various areas including the design, synthesis, characterization, and evaluation of emerging materials, understanding the relationships between structure, property, and performance, as well as developing materials for applications in energy, environment, biomedical, electronics, and catalysis. The journal has a 2-year impact factor of 11.4 and is dedicated to publishing transformative materials research with fast processing times. The editors and staff of ACS Materials Letters actively participate in major scientific conferences and engage closely with readers and authors. The journal also maintains an active presence on social media to provide authors with greater visibility.