Shuai Ma , Di Dong , Ye Gao , Zhuangzhi Wu , Dezhi Wang
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引用次数: 0
Abstract
This study systematically investigates the tensile creep properties and failure mechanisms of the W-Re-HfC (tungsten‑rhenium-HfC) alloy under near service temperatures of 1600–2000 °C with stresses of 40–80 MPa. Results show the corresponding stress exponent varies from 2.56 to 4.04, while the creep activation energy ranges from 372.4 to 569.5 kJ·mol−1. Besides, the Larson-Miller parameter model demonstrates excellent predictive capability for creep life. The dominant creep mechanism shifts from the diffusion-controlled creep at 1600 °C to the dislocation-dominated type at 1800 °C. Microstructural analysis reveals interactions between creep deformation and recrystallization that influence the creep mechanism. And HfC particles effectively inhibit dislocation motion and grain boundary sliding, enhancing creep resistance. Slip bands collisions with grain boundaries play a role in dislocation creep failure. This work provides essential theoretical insights and data support for the engineering design of W-Re-HfC alloys in aerospace, nuclear energy, and semiconductor industries.
期刊介绍:
The International Journal of Refractory Metals and Hard Materials (IJRMHM) publishes original research articles concerned with all aspects of refractory metals and hard materials. Refractory metals are defined as metals with melting points higher than 1800 °C. These are tungsten, molybdenum, chromium, tantalum, niobium, hafnium, and rhenium, as well as many compounds and alloys based thereupon. Hard materials that are included in the scope of this journal are defined as materials with hardness values higher than 1000 kg/mm2, primarily intended for applications as manufacturing tools or wear resistant components in mechanical systems. Thus they encompass carbides, nitrides and borides of metals, and related compounds. A special focus of this journal is put on the family of hardmetals, which is also known as cemented tungsten carbide, and cermets which are based on titanium carbide and carbonitrides with or without a metal binder. Ceramics and superhard materials including diamond and cubic boron nitride may also be accepted provided the subject material is presented as hard materials as defined above.