Scalable chip-based 3D ion traps

IF 5 2区 物理与天体物理 Q1 PHYSICS, MULTIDISCIPLINARY
Elena Jordan, Malte Brinkmann, Alexandre Didier, Erik Jansson, Martin Steinel, Nils Huntemann, Hu Shao, Hendrik Siebeneich, Christof Wunderlich, Michael Johanning and Tanja E Mehlstäubler
{"title":"Scalable chip-based 3D ion traps","authors":"Elena Jordan, Malte Brinkmann, Alexandre Didier, Erik Jansson, Martin Steinel, Nils Huntemann, Hu Shao, Hendrik Siebeneich, Christof Wunderlich, Michael Johanning and Tanja E Mehlstäubler","doi":"10.1088/2058-9565/adf2db","DOIUrl":null,"url":null,"abstract":"Ion traps are used for a wide range of applications from metrology to quantum simulations and quantum information processing. Microfabricated chip-based 3D ion traps are scalable to store many ions for the realization of a large number of qubits, provide deep trapping potentials compared to surface traps, and very good shielding from external electric fields. In this work, we give an overview of our recent developments on chip-based 3D ion traps. Different types of chip materials, the integration of electronic filter components on-chip and compact electrical connections in vacuum are discussed. Further, based on finite element method simulations, we discuss how integrating micro-optics in 3D ion traps is possible without disturbing the trapped ions.","PeriodicalId":20821,"journal":{"name":"Quantum Science and Technology","volume":"15 1","pages":""},"PeriodicalIF":5.0000,"publicationDate":"2025-08-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Quantum Science and Technology","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.1088/2058-9565/adf2db","RegionNum":2,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"PHYSICS, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

Ion traps are used for a wide range of applications from metrology to quantum simulations and quantum information processing. Microfabricated chip-based 3D ion traps are scalable to store many ions for the realization of a large number of qubits, provide deep trapping potentials compared to surface traps, and very good shielding from external electric fields. In this work, we give an overview of our recent developments on chip-based 3D ion traps. Different types of chip materials, the integration of electronic filter components on-chip and compact electrical connections in vacuum are discussed. Further, based on finite element method simulations, we discuss how integrating micro-optics in 3D ion traps is possible without disturbing the trapped ions.
可扩展的基于芯片的3D离子阱
离子阱的应用范围很广,从计量学到量子模拟和量子信息处理。基于微晶片的3D离子阱具有可扩展性,可存储大量离子以实现大量量子位,与表面阱相比,具有较深的捕获电位,并且对外部电场有很好的屏蔽作用。在这项工作中,我们概述了我们基于芯片的3D离子阱的最新发展。讨论了不同类型的芯片材料、片上电子滤波元件的集成以及真空中紧凑的电气连接。此外,基于有限元模拟,我们讨论了如何在不干扰被捕获离子的情况下将微光学集成到三维离子阱中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Quantum Science and Technology
Quantum Science and Technology Materials Science-Materials Science (miscellaneous)
CiteScore
11.20
自引率
3.00%
发文量
133
期刊介绍: Driven by advances in technology and experimental capability, the last decade has seen the emergence of quantum technology: a new praxis for controlling the quantum world. It is now possible to engineer complex, multi-component systems that merge the once distinct fields of quantum optics and condensed matter physics. Quantum Science and Technology is a new multidisciplinary, electronic-only journal, devoted to publishing research of the highest quality and impact covering theoretical and experimental advances in the fundamental science and application of all quantum-enabled technologies.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信