Yang Yuan , Wen Liu , Pingnan Huang , Nan Wu , Chaozhong Li
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引用次数: 0
Abstract
The increasing power density and miniaturization of modern electronics require highly efficient thermal management solutions. Although twisted tapes are commonly used to improve heat transfer in macro-scale devices, their use in microscale devices like microchannel heat sinks (MHS) has not been thoroughly investigated. A microchannel heat sink (MHS) with hollow twisted tapes was designed in this paper, and its thermal–hydraulic performance was investigated by numerical simulation method. The results showed that compared to the thermal–hydraulic performance of traditional twisted tape, the hollow twisted tape achieves an 80 % decrease in pressure drop with a 19 % reduction in Nu. Response surface analysis on the designed MHS indicate that reduction of tape pitch and hollow core diameter significantly increases Nu and f, while a decrease in thickness and length leads to a decrease in Nu and f. To maximize the Nusselt number (Nu) and minimize the friction factor (f), multi-objective design optimization of the twisted tape was conducted through the standard second-order response surface method and multi-objective genetic algorithm (MOGA). At a Re = 500, the optimized structure results in a 19 % increase in Nu, a 24 % decrease in f, and a 27 % increase in Figure of Merit (FoM). These results are helpful for the design of microchannel heat sinks in industry.
期刊介绍:
The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows.
Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.