Simulation Predictions of Surface Modified AlNp/CE Composites’ TC and Research on the Thermal Conduction Mechanism

Abstract

In this research, a series of composite materials featuring a three-dimensional thermal conductivity network of fillers was prepared through hot press molding. Scanning electron microscopy (SEM) results demonstrate that the modified aluminum nitride (AlN) particles are uniformly dispersed throughout the cyanate ester resin (CE) and form an interconnected network structure, creating an effective thermal conductivity pathway. The thermal conductivity (TC) of the modified composites was significantly enhanced. At a volume fraction of 58% of modified AlN, the thermal conductivity of the APTES@AlN/CE composites reached 1.81 W/m·K, representing a 47% improvement compared to the unmodified AlN/CE composites. The TC of the filled composites was calculated using the Agari Model, Bruggeman Model, and Cheng–Vachon Model. The results indicate that the calculated values are generally in agreement with the experimental results, with a minimum error rate of 2%. In this paper, a method is proposed to explore the thermal conductivity mechanism by reasonably modifying the thermal conductivity model, so as to make the simulation results consistent with the actual situation and provide guidance for the preparation of composites with high TC.