Junchuan Gu , Yang Chen , Wenwei Wang , Akash Kumar , Salim Ullah , Kejie Huang , Haibin Shen
{"title":"A bit-level loosely coupled computing-in-memory macro with early termination","authors":"Junchuan Gu , Yang Chen , Wenwei Wang , Akash Kumar , Salim Ullah , Kejie Huang , Haibin Shen","doi":"10.1016/j.mejo.2025.106796","DOIUrl":null,"url":null,"abstract":"<div><div>Computing-in-memory (CIM) has emerged as a promising solution for artificial intelligence (AI) edge devices. However, conventional bit-slicing CIM designs necessitate the availability of all input bits prior to the computation process. This tight coupling between input and output bits results in a substantial need for temporary storage and leads to significant output delays. In this article, we propose a bit-level loosely coupled (BLC) computation scheme for CIM macros, which reduces the bit widths of temporary data to 1 bit, thereby saving register demand. Accuracy and computational efficiency is further enhanced by zero detection scheme and early termination scheme. A CIM macro is designed to implement BLC multiply and accumulate (MAC) computation. Compared with the 8-bit quantized model, our proposed scheme incurs only 0.29% and 0.52% accuracy loss on AlexNet and ResNet20 (CIFAR-10 dataset), respectively. In a 40-nm process, the power consumption of our CIM macro is 3.54 mW (256 x 256 at 8-bit) and the computing-power ratio is 37.01 TOPS/W.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"164 ","pages":"Article 106796"},"PeriodicalIF":1.9000,"publicationDate":"2025-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239125002450","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Computing-in-memory (CIM) has emerged as a promising solution for artificial intelligence (AI) edge devices. However, conventional bit-slicing CIM designs necessitate the availability of all input bits prior to the computation process. This tight coupling between input and output bits results in a substantial need for temporary storage and leads to significant output delays. In this article, we propose a bit-level loosely coupled (BLC) computation scheme for CIM macros, which reduces the bit widths of temporary data to 1 bit, thereby saving register demand. Accuracy and computational efficiency is further enhanced by zero detection scheme and early termination scheme. A CIM macro is designed to implement BLC multiply and accumulate (MAC) computation. Compared with the 8-bit quantized model, our proposed scheme incurs only 0.29% and 0.52% accuracy loss on AlexNet and ResNet20 (CIFAR-10 dataset), respectively. In a 40-nm process, the power consumption of our CIM macro is 3.54 mW (256 x 256 at 8-bit) and the computing-power ratio is 37.01 TOPS/W.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.