Electron beam-induced damage in tellurium dioxide

IF 2.2 3区 工程技术 Q1 MICROSCOPY
Cathal Cassidy
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Abstract

In this work, structural and compositional changes in α-TeO2, also known as paratellurite, were studied as function of 300 kV electron beam exposure. Firstly, the mean free path for electron scattering in α-TeO2 was measured, to enable local specimen thickness measurement and estimation of scattering probabilities. A value of λ = 155 nm ± 6 nm was obtained, for the specific experimental conditions as detailed in the text. Then, high resolution TEM images and EEL spectra were acquired as a function of electron beam exposure, and the material changes were recorded. Differing behaviors, ranging from complete specimen etching, reduction to elemental tellurium, or no effect, were observed depending on the specific specimen and illumination conditions that were employed. Markedly different material changes were observed under broad illumination (TEM mode) and focused probe illumination (STEM mode). In STEM mode, a threshold effect in the applied electron dose rate was observed. For the conditions employed, with a beam current of 45 pA or less, there was no significant damage to the specimen. In TEM mode, it was observed that specimen damage was enhanced at the periphery of the illuminating electron beam area, and proceeded more rapidly in thicker regions of the specimen. Under certain illumination conditions, a stable network of tellurium oxide and elemental tellurium was formed. While only a small fraction of the parameter space governing electron-beam induced damage has been investigated, the results to date indicate that specimen charging and induced electric fields are the dominant mechanism of damage in this insulating material.
电子束致二氧化碲损伤
本文研究了300 kV电子束辐照下α-TeO2(又称副卫星石)的结构和组成变化。首先,测量了α-TeO2中电子散射的平均自由程,实现了局部试样厚度测量和散射概率估计。得到的λ值为155 nm±6 nm,具体实验条件详见文中。然后,获得高分辨率TEM图像和EEL光谱作为电子束辐照的函数,并记录材料的变化。不同的行为,从完全的试样蚀刻,还原到元素碲,或没有影响,观察到取决于具体的试样和照明条件所采用。在宽照度(TEM模式)和聚焦探针照度(STEM模式)下观察到明显不同的物质变化。在STEM模式下,观察到施加电子剂量率的阈值效应。对于所采用的条件,在45 pA或更小的光束电流下,对样品没有明显的损伤。在TEM模式下,观察到在照射电子束区域的外围,试样的损伤增强,在较厚的区域,试样的损伤进行得更快。在一定的光照条件下,形成了稳定的氧化碲和单质碲网络。虽然只研究了电子束诱导损伤的一小部分参数空间,但迄今为止的结果表明,试样充电和感应电场是这种绝缘材料损伤的主要机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Micron
Micron 工程技术-显微镜技术
CiteScore
4.30
自引率
4.20%
发文量
100
审稿时长
31 days
期刊介绍: Micron is an interdisciplinary forum for all work that involves new applications of microscopy or where advanced microscopy plays a central role. The journal will publish on the design, methods, application, practice or theory of microscopy and microanalysis, including reports on optical, electron-beam, X-ray microtomography, and scanning-probe systems. It also aims at the regular publication of review papers, short communications, as well as thematic issues on contemporary developments in microscopy and microanalysis. The journal embraces original research in which microscopy has contributed significantly to knowledge in biology, life science, nanoscience and nanotechnology, materials science and engineering.
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