{"title":"A novel direct hot rolling process for sustainable recycling of AA3105 aluminum chips using a protective envelopment","authors":"M. El Mehtedi, M. Carta, P. Buonadonna","doi":"10.1016/j.mfglet.2025.06.208","DOIUrl":null,"url":null,"abstract":"<div><div>This study explores a novel recycling process for AA3105 aluminum chips, incorporating an AA1050 aluminum envelope to facilitate the use of lubricants and improve surface quality without compromising chip bonding. The process, conducted at 540 °C, enhances microstructural uniformity, mechanical properties, and surface finish, addressing key challenges associated with traditional recycling methods. Microstructural analysis using optical microscopy and SEM confirmed effective chip consolidation, with minimal defects and elongated grain structures aligned along the rolling direction. Tensile testing revealed enhanced mechanical properties with a yield strength of 99 MPa, ultimate tensile strength of 139 MPa, and elongation at break of 16.7 %.</div></div>","PeriodicalId":38186,"journal":{"name":"Manufacturing Letters","volume":"45 ","pages":"Pages 70-74"},"PeriodicalIF":2.0000,"publicationDate":"2025-07-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Manufacturing Letters","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2213846325002597","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
This study explores a novel recycling process for AA3105 aluminum chips, incorporating an AA1050 aluminum envelope to facilitate the use of lubricants and improve surface quality without compromising chip bonding. The process, conducted at 540 °C, enhances microstructural uniformity, mechanical properties, and surface finish, addressing key challenges associated with traditional recycling methods. Microstructural analysis using optical microscopy and SEM confirmed effective chip consolidation, with minimal defects and elongated grain structures aligned along the rolling direction. Tensile testing revealed enhanced mechanical properties with a yield strength of 99 MPa, ultimate tensile strength of 139 MPa, and elongation at break of 16.7 %.