A 28 nm Dual-Mode SRAM-CIM Macro With Local Computing Cell for CNNs and Grayscale Edge Detection

IF 3.1 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Chunyu Peng;Xiaohang Chen;Mengya Gao;Jiating Guo;Lijun Guan;Chenghu Dai;Zhiting Lin;Xiulong Wu
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Abstract

With the rise of artificial intelligence (AI), neural network applications are growing in demand for efficient data transmission. The traditional von Neumann architecture can no longer keep pace with modern technological needs. Computing-in-memory (CIM) is proposed as a promising solution to address this bottleneck. This work introduces a local computing cell (LCC) scheme based on compact 6T-SRAM cells. The proposed circuit aims to enhance energy efficiency and reduce power consumption by reusing the LCC. The LCC circuit can perform the multiplication of a 2-bit input with a 1-bit weight, which can be applied to convolutional neural networks (CNNs) with the multiply-accumulate (MAC) operations. Through circuit reuse, it can also be used for multibit multiply operations, performing 2-bit input multiplication and 1-bit weight addition, which can be applied to grayscale edge detection in images. The energy efficiency of the SRAM-CIM macro achieves an energy efficiency of 46.3 TOPS/W under MAC operations with input precision of 8-bits and weight precision of 8-bits, and up to 389.1–529.1 TOPS/W under the calculation in one subarray with an input precision of 2-bits and a weight precision of 1-bit. The estimated inference accuracy on CIFAR-10 datasets is 90.21%.
用于cnn和灰度边缘检测的28nm双模SRAM-CIM宏
随着人工智能(AI)的兴起,神经网络应用对高效数据传输的需求日益增长。传统的冯·诺依曼建筑已经跟不上现代技术的需要。内存计算(CIM)被认为是解决这一瓶颈的一个很有前途的解决方案。本文介绍了一种基于紧凑6T-SRAM单元的局部计算单元(LCC)方案。该电路旨在通过重复使用LCC来提高能源效率和降低功耗。LCC电路可以实现2位输入与1位权值的乘法运算,可以应用于卷积神经网络(cnn)的乘法累加(MAC)运算。通过电路复用,还可用于多位乘法运算,进行2位输入乘法和1位权值相加,可应用于图像的灰度边缘检测。在MAC操作下,SRAM-CIM宏的能量效率为46.3 TOPS/W,输入精度为8位,权值精度为8位,在一个子阵列中计算,输入精度为2位,权值精度为1位,能量效率可达389.1-529.1 TOPS/W。在CIFAR-10数据集上估计的推理准确率为90.21%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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