A High-Density Energy-Efficient CNM Macro Using Hybrid RRAM and SRAM for Memory-Bound Applications

IF 3.1 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Jun Wang;Shengzhe Yan;Xiangqu Fu;Zhihang Qian;Zhi Li;Zeyu Guo;Zhuoyu Dai;Zhaori Cong;Chunmeng Dou;Feng Zhang;Jinshan Yue;Dashan Shang
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引用次数: 0

Abstract

The big data era has facilitated various memory-centric algorithms, such as the Transformer decoder, neural network, stochastic computing (SC), and genetic sequence matching, which impose high demands on memory capacity, bandwidth, and access power consumption. The emerging nonvolatile memory devices and compute-near-memory (CNM) architecture offer a promising solution for memory-bound tasks. This work proposes a hybrid resistive random access memory (RRAM) and static random access memory (SRAM) CNM architecture. The main contributions include: 1) proposing an energy-efficient and high-density CNM architecture based on the hybrid integration of RRAM and SRAM arrays; 2) designing low-power CNM circuits using the logic gates and dynamic-logic adder with configurable datapath; and 3) proposing a broadcast mechanism with output-stationary workflow to reduce memory access. The proposed RRAM-SRAM CNM architecture and dataflow tailored for four distinct applications are evaluated at a 28-nm technology, achieving 4.62-TOPS $/$ W energy efficiency and 1.20-Mb $/$ mm2 memory density, which shows $11.35\times $ $25.81\times $ and $1.44\times $ $4.92\times $ improvement compared to previous works, respectively.
基于混合RRAM和SRAM的高密度高能效CNM宏
大数据时代催生了各种以内存为中心的算法,如Transformer解码器、神经网络、随机计算(SC)和基因序列匹配,这些算法对内存容量、带宽和访问功耗提出了很高的要求。新兴的非易失性存储设备和计算近内存(CNM)体系结构为内存受限任务提供了一个有前途的解决方案。本文提出了一种混合电阻随机存取存储器(RRAM)和静态随机存取存储器(SRAM)的CNM架构。主要贡献包括:1)提出了一种基于RRAM和SRAM阵列混合集成的节能高密度CNM架构;2)采用可配置数据通路的逻辑门和动态逻辑加法器设计低功耗CNM电路;3)提出了一种具有输出静止工作流的广播机制,以减少内存访问。针对四种不同应用的RRAM-SRAM CNM架构和数据流在28纳米技术下进行了评估,实现了4.62-TOPS $/$ W的能效和1.20 mb $/$ mm2的存储密度,与之前的工作相比,分别提高了11.35 $ ~ 25.81 $和1.44 $ ~ 4.92 $。
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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