An Overview of AI Hardware Architectures and Silicon for 3-D Spatial Computing Systems

Abstract

As artificial intelligence (AI) advances, 3-D spatial computing has emerged as a key application in various fields. It interprets the 3-D space surrounding users and provides them with useful information. This article presents a survey of AI hardware architectures and silicon solutions for 3-D spatial computing systems. The survey categorizes five domains: 1) 3-D data capturing; 2) 3-D data analysis; 3) 3-D hand motion analysis; 4) simultaneous localization and mapping (SLAM); and 5) 3-D rendering. Each session analyzes design considerations for domain-specific accelerators. Finally, this article discusses a next-generation 3-D spatial computing platform that integrates various functions of 3-D spatial computing systems using AI technologies.