Jie Mei, Huimin Liao*, Siqi Yang*, Mingtai Liu, Hao Tu and Jian Wang*,
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引用次数: 0
Abstract
With the rapid advancement of modern communication and infrared detection technologies, there is an urgent demand in military protection for multiband electromagnetic interference (EMI) shielding materials integrated with infrared stealth capabilities. Traditional passive infrared stealth strategies relying on thermal resistance materials and low infrared emissivity coatings often fail to achieve stable temperature regulation in complex environments, leading to target exposure due to thermal contrasts. To address this, we developed an innovative PF@Ag-MF@Ag-x composite via an electroless plating process. By constructing a continuous conductive network through silver layer growth on a three-dimensional framework, the composite couples the unique electronic properties of silver with multiscale heterogeneous interfaces, achieving exceptional broadband EMI shielding effectiveness of 92.3 dB (X band) and 90.1 dB (Ku band). The hierarchical pore structure synergizes with low infrared emissivity to enable efficient passive infrared stealth by suppressing heat conduction and radiation. Furthermore, a dual-mode electrothermal conversion mechanism, combined with plasmon resonance effects, allows active temperature modulation for adaptive infrared camouflage through dynamic environmental thermal matching. This composite integrates multiband electromagnetic protection with active-passive infrared stealth, offering an innovative solution for all-weather electromagnetic/infrared integrated protection in military equipment.
随着现代通信技术和红外探测技术的飞速发展,军用防护领域迫切需要具有红外隐身能力的多波段电磁干扰屏蔽材料。传统的被动红外隐身策略依赖于热阻材料和低红外发射率涂层,在复杂环境下往往无法实现稳定的温度调节,导致目标因热反差暴露。为了解决这个问题,我们通过化学镀工艺开发了一种创新的PF@Ag-MF@Ag-x复合材料。通过在三维框架上生长银层构建连续导电网络,复合材料将银的独特电子特性与多尺度非均质界面耦合在一起,实现了92.3 dB (X波段)和90.1 dB (Ku波段)的宽带EMI屏蔽效果。分层孔隙结构与低红外发射率协同作用,通过抑制热传导和辐射,实现有效的被动红外隐身。此外,双模电热转换机制,结合等离子体共振效应,允许通过动态环境热匹配进行自适应红外伪装的主动温度调制。这种复合材料集成了多波段电磁保护和主动被动红外隐身,为军事装备中的全天候电磁/红外综合保护提供了创新的解决方案。
期刊介绍:
ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.