Zhongshu Ren , Samuel J. Clark , Lin Gao , Kamel Fezzaa , Tao Sun
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引用次数: 0
Abstract
A variety of protective or reactive environmental gases have recently gained growing attention in laser-based metal additive manufacturing (AM) technologies due to their unique thermophysical properties and the potential improvements they can bring to the build processes. However, much remains unclear regarding the effects of different gas environments on critical phenomena in laser AM, such as rapid cooling, energy coupling, and defect generation. Through simultaneous high-speed synchrotron x-ray imaging and thermal imaging, we identify distinct effects of two environmental gases in laser AM and gained a deeper understanding of the underlying mechanisms. Compared to the commonly used protective gas, argon, it is found that helium has a negligible effect on cooling the part. However, helium can suppress unstable keyholes by decreasing effective energy absorption, thus mitigating keyhole porosity generation and reducing pore size under certain processing conditions. These observations provide guidelines for the strategic use of environmental gases in laser AM to produce parts with improved quality.
期刊介绍:
Additive Manufacturing stands as a peer-reviewed journal dedicated to delivering high-quality research papers and reviews in the field of additive manufacturing, serving both academia and industry leaders. The journal's objective is to recognize the innovative essence of additive manufacturing and its diverse applications, providing a comprehensive overview of current developments and future prospects.
The transformative potential of additive manufacturing technologies in product design and manufacturing is poised to disrupt traditional approaches. In response to this paradigm shift, a distinctive and comprehensive publication outlet was essential. Additive Manufacturing fulfills this need, offering a platform for engineers, materials scientists, and practitioners across academia and various industries to document and share innovations in these evolving technologies.