Hot wear resistance of Cu/Ti2SnC composite wire

Abstract

This work investigated the hot wear resistance of Cu/Ti₂SnC composite wire. Scanning electron microscope, optical microscope, and electron back-scattered diffraction (EBSD) were used. The wear test was done at temperatures of 250 °C and 400 °C. By decreasing the reinforcement content, the grain size increased and then decreased but the texture became stronger due to the higher strain. The strong texture influenced the strength and by increasing the reinforcement content, the yield and tensile strength increased and reached 297.8 MPa and 490.3 MPa, respectively, for the wire with 6 vol% Ti₂SnC which contained strengthening mechanisms of dislocation hardening and load transfer. At the hot wear test, the 6-vol% Ti₂SnC wire showed better wear resistance than the pure copper wire due to the proper load transfer of Ti₂SnC particles and the formation of a more mechanical mixture layer (MML). The formed MML caused by the interaction of the wire interface with small debris on the disk interface, provided more protection. The worn SEM images showed that the main wear mechanisms of the extruded wires were adhesion, abrasion, delamination, and oxidation.