N,N-Dimethyl-p-toluidine crosslinker enables acrylic-based resin with seamless adhesion and high performance

Abstract

This study focuses on the development of a novel seamless adhesive by investigating the interaction of N,N-dimethyl-p-toluidine (DMPT) in an acrylic-based polymer system. The optimal proportions of benzoyl peroxide (BPO) and DMPT were determined to achieve ideal curing time and fracture toughness, making the adhesive highly suitable for industrial applications. The prepared adhesive demonstrated a curing time that balances efficiency with performance, facilitating seamless splicing of artificial stone materials in production lines. The optimal curing time achieved was approximately 10 min at 25 °C, with a stress intensity factor (K) reaching up to 12.32 kPa m^1/2, demonstrating significant improvement in both efficiency and mechanical strength. Additionally, the ability to adjust the resin-to-powder ratio presents significant cost-saving opportunities for manufacturers. The adhesive exhibited remarkable color stability, with minimal changes observed even under elevated temperatures, resulting in nearly invisible splicing joints. These qualities, combined with strong bonding performance and aesthetic advantages, make the adhesive a promising candidate for use in bioelectronic devices, where durability, versatility, and optical clarity are essential. This research demonstrates the potential of advanced acrylic adhesives to enhance both traditional construction applications and emerging technologies in bioelectronics.