Resistivity-temperature behavior of Cu-Ni-Al alloys strengthened by coherent precipitation within a wide composition range

IF 3.8 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Vacuum Pub Date : 2025-07-12 DOI:10.1016/j.vacuum.2025.114578

Shengbin Li , Changfeng Song , Yuan Li , Jinyi Ge , Zhumin Li , Yuehong Zheng , Ling Li , Jiansheng Li

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Abstract

The coherent precipitation-strengthened Cu-Ni-Al ternary alloy exhibits high strength, high elasticity, and good electrical conductivity. Clarifying its resistivity-temperature behavior is essential. In this study, the microstructure evolution and the mechanism of resistivity-temperature behavior of Cu-Ni-Al ternary alloys was systematically analyzed. The results indicate that the microstructure of these alloys comprises a γ matrix and a feather-like γ′ coherent precipitation phase. The variable-temperature resistivity of the Cu-Ni-Al ternary alloy is closely associated with the total amount of (Ni + Al) dissolved in the γ phase. Lower (Ni + Al) content reduces electron-electron scattering and phonon-electron scattering, thereby decreasing room-temperature resistivity. During the heating process, with the increase of Cu content, the slope of resistivity change with temperature gradually decreases, accompanied by a reduction in vacancy formation energy, which diminishes the thermal stability of the γ phase.

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Cu-Ni-Al合金在宽成分范围内的共格沉淀强化的电阻-温度行为

共格沉淀强化Cu-Ni-Al三元合金具有高强度、高弹性和良好的导电性。澄清其电阻-温度行为是必要的。本研究系统地分析了Cu-Ni-Al三元合金的显微组织演变和电阻-温度行为机理。结果表明，这些合金的显微组织由γ基体和羽状γ′相组成。Cu-Ni-Al三元合金的变温电阻率与γ相中溶解的（Ni + Al）总量密切相关。较低的（Ni + Al）含量降低了电子-电子散射和声子-电子散射，从而降低了室温电阻率。在加热过程中，随着Cu含量的增加，电阻率随温度变化的斜率逐渐减小，伴随着空位形成能的降低，使γ相的热稳定性降低。

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来源期刊

Vacuum 工程技术-材料科学：综合

CiteScore

6.80

自引率

17.50%

发文量

审稿时长

34 days

期刊介绍： Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.