Near-Field Radiation Prediction for Neuromorphic Chip Based on Deep Learning

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Yan Li;Li-Nan Mo;Dianjun Deng;Guoliang Yu;Yang Qiu;Mingmin Zhu;Jiawei Wang;Haomiao Zhou;Da Li;En-Xiao Liu;Er-Ping Li
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引用次数: 0

Abstract

This article proposes an enhanced equivalent dipole model, integrating convolutional neural networks and fully connected networks, to predict near-field magnetic fields in neuromorphic chips. Traditional dipole models struggle with complex electromagnetic interactions, such as multiple reflections and diffractions, which occur in dense neuromorphic circuits. To address these challenges, the proposed method constructs a coefficient matrix based on the spatial relationships between scanning points and dipoles. This matrix is used as input to the neural network, which predicts the radiation field magnitude as output. The model is trained to accurately predict magnetic fields beyond the scanned area. The approach is validated through both numerical simulations and experimental measurements, showing a relative error of approximately 5% between predicted and measured values, indicating high accuracy.
基于深度学习的神经形态芯片近场辐射预测
本文提出了一种增强的等效偶极子模型,结合卷积神经网络和全连接网络来预测神经形态芯片中的近场磁场。传统的偶极子模型难以处理复杂的电磁相互作用,例如在密集的神经形态电路中发生的多重反射和衍射。为了解决这些问题,该方法基于扫描点与偶极子之间的空间关系构建了一个系数矩阵。该矩阵作为神经网络的输入,神经网络预测辐射场的大小作为输出。该模型经过训练,可以准确预测扫描区域以外的磁场。通过数值模拟和实验测量验证了该方法的有效性,预测值与实测值的相对误差约为5%,具有较高的精度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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