Dual-Band Low-Profile Antenna Design Using HMSIW Based on Through-Glass Vias (TGVs)

IF 4.8 2区计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Antennas and Wireless Propagation Letters Pub Date : 2025-03-31 DOI:10.1109/LAWP.2025.3556293

Shuqi Li;Hongwei Chen;Zhen Fang;Jinxu Liu;Libin Gao;Xiaoshen Han;Shan Li;Jihua Zhang

{"title":"Dual-Band Low-Profile Antenna Design Using HMSIW Based on Through-Glass Vias (TGVs)","authors":"Shuqi Li;Hongwei Chen;Zhen Fang;Jinxu Liu;Libin Gao;Xiaoshen Han;Shan Li;Jihua Zhang","doi":"10.1109/LAWP.2025.3556293","DOIUrl":null,"url":null,"abstract":"This letter presents two dual-band (DB) low-profile antenna designs for Ka-band applications, integrating a hybrid structure of a DB-patch and a DB-half-mode substrate integrated waveguide resonator fabricated using through-glass vias (TGVs) technology. The proposed designs achieve DB operation with enhanced bandwidth and gain, all within a single-layer substrate to maintain a compact profile. Ant.1 employs a dual-cavity configuration, while Ant. 2 utilizes a single cavity supporting <inline-formula><tex-math>$\\text{TE}_{101}$</tex-math></inline-formula> and <inline-formula><tex-math>$\\text{TE}_{301}$</tex-math></inline-formula> mode. A prototype of Ant. 1 was fabricated and tested to validate the design. Measurements demonstrate a −10 dB impedance bandwidth of 25.58 GHz to 28.26 GHz (10%) for the lower band and 36.83 GHz to 38.94 GHz (5.5%) for the higher band, with peak gains of 6.1 dBi and 5.6 dBi, respectively. Compared to existing designs, Ant. 1 achieves a lower profile (0.04 <inline-formula><tex-math>$\\lambda _{0}$</tex-math></inline-formula>) in the Ka band while maintaining competitive performance. This work offers a promising solution for compact and efficient DB antennas in Ka-band communication systems.","PeriodicalId":51059,"journal":{"name":"IEEE Antennas and Wireless Propagation Letters","volume":"24 7","pages":"2109-2113"},"PeriodicalIF":4.8000,"publicationDate":"2025-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Antennas and Wireless Propagation Letters","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10945716/","RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

This letter presents two dual-band (DB) low-profile antenna designs for Ka-band applications, integrating a hybrid structure of a DB-patch and a DB-half-mode substrate integrated waveguide resonator fabricated using through-glass vias (TGVs) technology. The proposed designs achieve DB operation with enhanced bandwidth and gain, all within a single-layer substrate to maintain a compact profile. Ant.1 employs a dual-cavity configuration, while Ant. 2 utilizes a single cavity supporting

$\text{TE}_{101}$

and

$\text{TE}_{301}$

mode. A prototype of Ant. 1 was fabricated and tested to validate the design. Measurements demonstrate a −10 dB impedance bandwidth of 25.58 GHz to 28.26 GHz (10%) for the lower band and 36.83 GHz to 38.94 GHz (5.5%) for the higher band, with peak gains of 6.1 dBi and 5.6 dBi, respectively. Compared to existing designs, Ant. 1 achieves a lower profile (0.04

$\lambda _{0}$

) in the Ka band while maintaining competitive performance. This work offers a promising solution for compact and efficient DB antennas in Ka-band communication systems.

查看原文本刊更多论文

基于玻璃通孔（TGVs）的HMSIW双频低轮廓天线设计

本文介绍了两种用于ka波段应用的双频（DB）低轮廓天线设计，集成了采用玻璃通孔（TGVs）技术制造的DB贴片和DB半模基板集成波导谐振器的混合结构。提出的设计实现了具有增强带宽和增益的DB操作，所有这些都在单层基板内，以保持紧凑的外形。Ant.1采用双腔配置，而Ant. 2使用单腔支持$\text{TE}_{101}$和$\text{TE}_{301}$模式。制作了Ant. 1的原型并进行了测试以验证该设计。测量表明，- 10 dB阻抗带宽为25.58 GHz至28.26 GHz(10%)，较低频段为36.83 GHz至38.94 GHz(5.5%)，峰值增益分别为6.1 dBi和5.6 dBi。与现有设计相比，Ant. 1在Ka波段实现了较低的配置（0.04 $\lambda _{0}$），同时保持了具有竞争力的性能。这项工作为ka波段通信系统中紧凑高效的DB天线提供了一个有前途的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

IEEE Antennas and Wireless Propagation Letters 工程技术-电信学

CiteScore

8.00

自引率

9.50%

发文量

529

审稿时长

1.0 months

期刊介绍： IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.