A universal method for constructing stretchable and conductive connections in flexible electronics

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Yahui Zhao, Qiyang Ruan, Tongtong Li, Hongyun Qiu, Ruipeng Zhang, Shuai Wen, Lifeng Chi, Shaobo Ji
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Abstract

Integrating stretchable and rigid electric units presents a significant challenge in manufacturing stretchable electronics. Their surface property differences prevented reliable stretching-tolerant connections. Here, we report a universal method to construct stretchable connections based on interfacial covalent reactions. It enables robust and conductive bonding among various soft/rigid electronics through simple surface modification and interfacial reaction. The bonding between SEBS rubber and metals reached stretchability over 250% with interfacial toughness over 200 N/m. The ultrathin connection layer provided conductive pathways, achieving an electrical stretchability of 60% between Au-deposited SEBS and Cu sheets. Connections between liquid metal-based stretchable conductors could withstand more than 10,000 stretching cycles to 60% strain while maintaining their high conductivity. The versatility and stability of this method were further proved by fabricating electronic devices that integrated soft and rigid units, including circuits on papers and a gesture-visualizing glove with LEDs, highlighting the robustness of the stretchable connections.

Abstract Image

在柔性电子产品中构建可拉伸和导电连接的通用方法
集成可拉伸和刚性电气单元是制造可拉伸电子产品的重大挑战。它们的表面特性差异阻碍了可靠的耐拉伸连接。在这里,我们报告了一种基于界面共价反应构建可拉伸连接的通用方法。通过简单的表面修饰和界面反应,它可以在各种软/刚性电子产品之间实现坚固的导电键合。SEBS橡胶与金属的结合可拉伸性达到250%以上,界面韧性达到200 N/m以上。超薄连接层提供了导电通道,在镀au的SEBS和Cu片之间实现了60%的电拉伸性。液态金属基可拉伸导体之间的连接可以承受超过10,000次拉伸循环,达到60%的应变,同时保持其高导电性。通过制造集成软硬单元的电子设备,包括纸上电路和带有led的手势可视化手套,进一步证明了这种方法的多功能性和稳定性,突出了可拉伸连接的稳健性。
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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