A high-precision 1 × 15 infrared temperature measurement linear array based on thermopile sensors.

Jindong Bai, Wenhang Yang, Shouzheng Zhu, Haijun Jin, Yuchen Zhang, Ke Jin, Xiaoshuai Liu, Chunlai Li, Jianyu Wang, Hongxing Qi, Shijie Liu
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Abstract

In applications such as those in the semiconductor industry, precise temperature measurements with low power consumption are crucial. This article presents a novel noncontact temperature measurement method with low power consumption and high precision, and a thermopile sensor-based linear array for surface temperature measurements is used in semiconductor manufacturing and temperature calibration applications. The array consists of 15 thermopile sensors, a negative temperature coefficient (NTC) thermistor, an FPGA control board with a fiber optic interface, and a motion module. Moreover, the total power consumption of the board is less than 1.5 W. On the FPGA control board, a multiparameter temperature compensation algorithm is used to address intrinsic temperature differences and consistency errors among the sensors. Compared with the traditional two-point calibration method, the temperature measurement accuracy of the proposed method reaches 26 mK in the temperature range of 293-303 K, the maximum repeatability error of the sensor is less than 5.5 mK, and the non-uniformity error between 15 sensors is less than 11.9 mK. The array and its replicas were subjected to more than 6 h of rigorous testing, demonstrating their high stability, with the reduction in accuracy not exceeding 1.5 mK.

基于热电堆传感器的高精度1 × 15红外测温线性阵列。
在半导体行业等应用中,低功耗的精确温度测量至关重要。本文介绍了一种低功耗、高精度的非接触式温度测量方法,以及一种基于热电堆传感器的线性阵列表面温度测量方法,用于半导体制造和温度校准应用。该阵列由15个热电堆传感器、一个负温度系数(NTC)热敏电阻、一个带光纤接口的FPGA控制板和一个运动模块组成。单板的总功耗小于1.5 W。在FPGA控制板上,采用多参数温度补偿算法来解决传感器之间的固有温差和一致性误差。与传统两点定标法相比,该方法在293 ~ 303 K温度范围内的测温精度达到26 mK,传感器的最大重复性误差小于5.5 mK, 15个传感器之间的非均匀性误差小于11.9 mK。该阵列及其复制品进行了超过6小时的严格测试,证明了它们的高稳定性,精度降低不超过1.5 mK。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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