{"title":"A high-precision 1 × 15 infrared temperature measurement linear array based on thermopile sensors.","authors":"Jindong Bai, Wenhang Yang, Shouzheng Zhu, Haijun Jin, Yuchen Zhang, Ke Jin, Xiaoshuai Liu, Chunlai Li, Jianyu Wang, Hongxing Qi, Shijie Liu","doi":"10.1038/s44172-025-00456-9","DOIUrl":null,"url":null,"abstract":"<p><p>In applications such as those in the semiconductor industry, precise temperature measurements with low power consumption are crucial. This article presents a novel noncontact temperature measurement method with low power consumption and high precision, and a thermopile sensor-based linear array for surface temperature measurements is used in semiconductor manufacturing and temperature calibration applications. The array consists of 15 thermopile sensors, a negative temperature coefficient (NTC) thermistor, an FPGA control board with a fiber optic interface, and a motion module. Moreover, the total power consumption of the board is less than 1.5 W. On the FPGA control board, a multiparameter temperature compensation algorithm is used to address intrinsic temperature differences and consistency errors among the sensors. Compared with the traditional two-point calibration method, the temperature measurement accuracy of the proposed method reaches 26 mK in the temperature range of 293-303 K, the maximum repeatability error of the sensor is less than 5.5 mK, and the non-uniformity error between 15 sensors is less than 11.9 mK. The array and its replicas were subjected to more than 6 h of rigorous testing, demonstrating their high stability, with the reduction in accuracy not exceeding 1.5 mK.</p>","PeriodicalId":72644,"journal":{"name":"Communications engineering","volume":"4 1","pages":"119"},"PeriodicalIF":0.0000,"publicationDate":"2025-07-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC12234851/pdf/","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Communications engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1038/s44172-025-00456-9","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In applications such as those in the semiconductor industry, precise temperature measurements with low power consumption are crucial. This article presents a novel noncontact temperature measurement method with low power consumption and high precision, and a thermopile sensor-based linear array for surface temperature measurements is used in semiconductor manufacturing and temperature calibration applications. The array consists of 15 thermopile sensors, a negative temperature coefficient (NTC) thermistor, an FPGA control board with a fiber optic interface, and a motion module. Moreover, the total power consumption of the board is less than 1.5 W. On the FPGA control board, a multiparameter temperature compensation algorithm is used to address intrinsic temperature differences and consistency errors among the sensors. Compared with the traditional two-point calibration method, the temperature measurement accuracy of the proposed method reaches 26 mK in the temperature range of 293-303 K, the maximum repeatability error of the sensor is less than 5.5 mK, and the non-uniformity error between 15 sensors is less than 11.9 mK. The array and its replicas were subjected to more than 6 h of rigorous testing, demonstrating their high stability, with the reduction in accuracy not exceeding 1.5 mK.