Metal 3-D Stacking-Enabled WR4.3-Band Power Amplifier Featuring High-Power-Density TM01-Mode Radial Power Combiner

IF 3.4 0 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE microwave and wireless technology letters Pub Date : 2025-04-18 DOI:10.1109/LMWT.2025.3557265

Kun Huang;Xiaojian Zhang;Ruoxue Li;Wei Su;Yue He;Hao Yang;Yaoling Tian;Jun Jiang

{"title":"Metal 3-D Stacking-Enabled WR4.3-Band Power Amplifier Featuring High-Power-Density TM01-Mode Radial Power Combiner","authors":"Kun Huang;Xiaojian Zhang;Ruoxue Li;Wei Su;Yue He;Hao Yang;Yaoling Tian;Jun Jiang","doi":"10.1109/LMWT.2025.3557265","DOIUrl":null,"url":null,"abstract":"This letter reports a novel WR-4.3 band solid-state radial power combiner featuring high power density. It integrates a TE10–TM01-mode transducer, eight reconfigurable compact two-channel combined power amplifier (PA) units, and a highly efficient eight-channel radial power combined network to enable a 16-channel terahertz (THz) monolithic integrated circuits (TMICSs) combined amplifier. Experimental results demonstrate a saturated output power of over 400 mW at around 220 GHz, with a peak output power of 436 mW achieved at 215.4 GHz, corresponding to a maximum active combining efficiency of 89%. Additionally, the radial power combiner exhibits an ultracompact form factor, with a total volume of only 30.4 cm2, resulting in a maximum functional power density exceeding 14.35 mW/cm2. This work highlights the potential of the proposed architecture for high-power THz applications requiring compact and efficient power-combining solutions.","PeriodicalId":73297,"journal":{"name":"IEEE microwave and wireless technology letters","volume":"35 7","pages":"1033-1036"},"PeriodicalIF":3.4000,"publicationDate":"2025-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE microwave and wireless technology letters","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10969823/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"0","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

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Abstract

This letter reports a novel WR-4.3 band solid-state radial power combiner featuring high power density. It integrates a TE₁₀–TM₀₁-mode transducer, eight reconfigurable compact two-channel combined power amplifier (PA) units, and a highly efficient eight-channel radial power combined network to enable a 16-channel terahertz (THz) monolithic integrated circuits (TMICSs) combined amplifier. Experimental results demonstrate a saturated output power of over 400 mW at around 220 GHz, with a peak output power of 436 mW achieved at 215.4 GHz, corresponding to a maximum active combining efficiency of 89%. Additionally, the radial power combiner exhibits an ultracompact form factor, with a total volume of only 30.4 cm², resulting in a maximum functional power density exceeding 14.35 mW/cm². This work highlights the potential of the proposed architecture for high-power THz applications requiring compact and efficient power-combining solutions.

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金属三维叠加wr4.3波段功率放大器，具有高功率密度tm01模式径向功率合成器

本文报道了一种具有高功率密度的新型WR-4.3波段固态径向功率合成器。它集成了一个te10 - tm01模式换能器、8个可重构的紧凑型双通道组合功率放大器（PA）单元和一个高效的八通道径向功率组合网络，以实现16通道太赫兹（THz）单片集成电路（tmics）组合放大器。实验结果表明，在220 GHz附近的饱和输出功率超过400 mW，在215.4 GHz的峰值输出功率达到436 mW，对应的最大主动组合效率为89%。此外，径向功率组合器具有超紧凑的外形，总体积仅为30.4 cm2，最大功能功率密度超过14.35 mW/cm2。这项工作突出了所提出的架构在需要紧凑和高效的功率组合解决方案的高功率太赫兹应用中的潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE microwave and wireless technology letters

CiteScore

6.00

自引率

0.00%

发文量