{"title":"Diffusion-assisted shrinkage of a spherical void","authors":"Fuqian Yang","doi":"10.1016/j.mechmat.2025.105425","DOIUrl":null,"url":null,"abstract":"<div><div>Vacancy diffusion plays an important role in the homogenization of microstructures and the “healing” of structural flaws in crystalline materials. In this work, we establish an analytical model taking into account the coupling between stress and diffusion for the void evolution in pure element materials if there is a difference between the partial molar volume of atoms and the corresponding one of vacancies. Provided that there is no difference between the partial molar volume of atoms and the corresponding one of vacancies, we use the model to analyze the shrinking of a spherical void in a spherical shell. Differential equations for the temporal evolution of the void are derived for two cases of constant surface loading and stress relaxation without surface loading. Numerical results illustrate that, under constant surface loading, the larger the spherical void with the same shell volume, the larger the “healing” time; the larger the shell volume with the same void size, the larger the “healing” time. Increasing the magnitude of hydrostatic pressure reduces the “healing” time of spherical voids. Without external loading, the smaller the spherical void, the faster the stress relaxation during the shrinking of the spherical void.</div></div>","PeriodicalId":18296,"journal":{"name":"Mechanics of Materials","volume":"209 ","pages":"Article 105425"},"PeriodicalIF":3.4000,"publicationDate":"2025-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Mechanics of Materials","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167663625001875","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Vacancy diffusion plays an important role in the homogenization of microstructures and the “healing” of structural flaws in crystalline materials. In this work, we establish an analytical model taking into account the coupling between stress and diffusion for the void evolution in pure element materials if there is a difference between the partial molar volume of atoms and the corresponding one of vacancies. Provided that there is no difference between the partial molar volume of atoms and the corresponding one of vacancies, we use the model to analyze the shrinking of a spherical void in a spherical shell. Differential equations for the temporal evolution of the void are derived for two cases of constant surface loading and stress relaxation without surface loading. Numerical results illustrate that, under constant surface loading, the larger the spherical void with the same shell volume, the larger the “healing” time; the larger the shell volume with the same void size, the larger the “healing” time. Increasing the magnitude of hydrostatic pressure reduces the “healing” time of spherical voids. Without external loading, the smaller the spherical void, the faster the stress relaxation during the shrinking of the spherical void.
期刊介绍:
Mechanics of Materials is a forum for original scientific research on the flow, fracture, and general constitutive behavior of geophysical, geotechnical and technological materials, with balanced coverage of advanced technological and natural materials, with balanced coverage of theoretical, experimental, and field investigations. Of special concern are macroscopic predictions based on microscopic models, identification of microscopic structures from limited overall macroscopic data, experimental and field results that lead to fundamental understanding of the behavior of materials, and coordinated experimental and analytical investigations that culminate in theories with predictive quality.