Anand Parkash, Abudukeremu Kadier and Peng-Cheng Ma
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引用次数: 0
Abstract
Addressing the escalating demand for lightweight, highly conductive, thin, large-area, and mechanically flexible materials with high electromagnetic interference (EMI) shielding effectiveness, alongside superior electrical and mechanical properties crucial for advanced wireless electronics and next-generation telecommunications (6G), we introduce a novel Cu-deposited basalt fiber fabric (BFF) fabricated via electroless Cu deposition across varying temperatures (room temperature to 60 °C). This material exhibits exceptional EMI shielding performance, achieving 81.7 dB in the X-band (8.2–12.4 GHz) at a minimal thickness of approximately 7.69 μm. Furthermore, it demonstrates significantly high electrical conductivity, reaching a peak of 4.81 × 105 S m−1, coupled with a low density of 3.08 g cm−3, substantially lighter than bulk Cu (8.96 g cm−3). The Cu-deposited BFF also possesses excellent mechanical properties, with breaking forces of 665 N (weft) and 3343 N (warp) achieved at the optimized deposition temperature of 50 °C, and superior Joule heating efficiency, reaching temperatures up to 136 °C at an applied voltage of 1.0 V. Integrating lightweight, high strength, thermal stability (up to 950 °C), and electrical conductivity, the Cu-deposited BFF presents itself as a sustainable and high-performance EMI shielding material with significant potential for scalable industrial applications.
期刊介绍:
Materials Chemistry Frontiers focuses on the synthesis and chemistry of exciting new materials, and the development of improved fabrication techniques. Characterisation and fundamental studies that are of broad appeal are also welcome.
This is the ideal home for studies of a significant nature that further the development of organic, inorganic, composite and nano-materials.