Yuyuan Zhang , Xu Zhang , Wen Wang , Jiawei Hou , Fengming Qiang , Yi Liu , Keyue Huo , Pengfei Zheng , Peng Han , Ke Qiao , Yuan Gao , Kuaishe Wang
{"title":"Dynamic precipitation behavior and recrystallization mechanism during hot deformation of 7E33 aluminum alloy","authors":"Yuyuan Zhang , Xu Zhang , Wen Wang , Jiawei Hou , Fengming Qiang , Yi Liu , Keyue Huo , Pengfei Zheng , Peng Han , Ke Qiao , Yuan Gao , Kuaishe Wang","doi":"10.1016/j.matchar.2025.115328","DOIUrl":null,"url":null,"abstract":"<div><div>The 7E33 aluminum alloy was engineered through microalloying conventional 7xxx series alloys with Er and Mn. The evolution of its microstructure during hot working directly affects the final product's mechanical properties. The hot deformation behavior of this alloy was investigated under deformation temperatures ranging from 350 °C to 500 °C and strain rates from 0.01 s<sup>−1</sup> to 10 s<sup>−1</sup> by isothermal compression tests in this study. Furthermore, an in-depth analysis was conducted on the microstructural evolution during the deformation process. The results show that the peak flow stress increased with decreasing deformation temperature and increasing strain rate. The strain-compensated Arrhenius constitutive equation was established based on the true stress-strain curve, demonstrating a correlation coefficient of 0.990 and an average absolute relative error of 3.842 %. Microstructural analysis demonstrated that the high-angle grain boundary (HAGBs) proportion was observed to first increase and then decrease with rising deformation temperature at a strain rate of 0.01 s<sup>−1</sup>. A maximum HAGBs fraction of 59.4 % was achieved at 400 °C. Some η-phase particles dissolve, some growth from 8 nm to 30 nm at 400 °C. When the temperature increased to 500 °C, η-phase re-precipitation was observed, characterized by an increase in particle number and a reduction in particle size to 3 nm. The pinning effect on dislocations and grain boundaries was significantly enhanced, resulting in a corresponding suppression of dynamic recrystallization. At 10 s<sup>−1</sup> and 450 °C, during the hot deformation, dislocations were aggregated to form a “stepped” structure, which could emit dislocations and further form dislocation networks. The dislocation networks ultimately evolve into subgrain boundaries. Furthermore, discontinuous dynamic recrystallization was significantly inhibited by an increase in deformation temperature, while continuous dynamic recrystallization was effectively suppressed by an elevation in strain rate.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"227 ","pages":"Article 115328"},"PeriodicalIF":5.5000,"publicationDate":"2025-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Characterization","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1044580325006175","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
引用次数: 0
Abstract
The 7E33 aluminum alloy was engineered through microalloying conventional 7xxx series alloys with Er and Mn. The evolution of its microstructure during hot working directly affects the final product's mechanical properties. The hot deformation behavior of this alloy was investigated under deformation temperatures ranging from 350 °C to 500 °C and strain rates from 0.01 s−1 to 10 s−1 by isothermal compression tests in this study. Furthermore, an in-depth analysis was conducted on the microstructural evolution during the deformation process. The results show that the peak flow stress increased with decreasing deformation temperature and increasing strain rate. The strain-compensated Arrhenius constitutive equation was established based on the true stress-strain curve, demonstrating a correlation coefficient of 0.990 and an average absolute relative error of 3.842 %. Microstructural analysis demonstrated that the high-angle grain boundary (HAGBs) proportion was observed to first increase and then decrease with rising deformation temperature at a strain rate of 0.01 s−1. A maximum HAGBs fraction of 59.4 % was achieved at 400 °C. Some η-phase particles dissolve, some growth from 8 nm to 30 nm at 400 °C. When the temperature increased to 500 °C, η-phase re-precipitation was observed, characterized by an increase in particle number and a reduction in particle size to 3 nm. The pinning effect on dislocations and grain boundaries was significantly enhanced, resulting in a corresponding suppression of dynamic recrystallization. At 10 s−1 and 450 °C, during the hot deformation, dislocations were aggregated to form a “stepped” structure, which could emit dislocations and further form dislocation networks. The dislocation networks ultimately evolve into subgrain boundaries. Furthermore, discontinuous dynamic recrystallization was significantly inhibited by an increase in deformation temperature, while continuous dynamic recrystallization was effectively suppressed by an elevation in strain rate.
期刊介绍:
Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials.
The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal.
The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include:
Metals & Alloys
Ceramics
Nanomaterials
Biomedical materials
Optical materials
Composites
Natural Materials.