{"title":"Preparation and surface modification of vertically structured indium/graphite elastomer thermal pad for effective heat dissipation","authors":"Yisimayili Tuersun, Pingjun Luo, Yixin Chen, Xu Huang, Mingdeng Huang, Sheng Chu","doi":"10.1016/j.coco.2025.102518","DOIUrl":null,"url":null,"abstract":"<div><div>In recent years, with the increasing integration level of modern electronics and the rise of artificial intelligence (AI) models, the development of advanced thermal interface materials (TIMs) for heat dissipation in high-power chips has become indispensable. Here in this work, based on the intrinsic high thermal conductivity of graphite and indium, the densely aligned vertical indium/graphite (@VInGr) thermal pad is prepared. The @VInGr exhibites a high through plane thermal conductivity (κ<sub>⊥</sub> of 103.6 W/m·K) and low compression modulus (1.45 Mpa). Based on the excellent wettability of liquid metal (LM) on indium, we performed surface modification to reduce the thermal resistance and further improve heat dissipation efficiency. As a result, due to the formation of a ‘solid-liquid’ interface bridge, the total thermal resistance (R<sub>total</sub>) decreased from 0.58 cm<sup>2</sup> K/W to 0.38 cm<sup>2</sup> K/W. Practical heat dissipation tests shows that when LM/@VInGr/LM is used as a thermal interface material (TIM), the temperature of LED bulb significantly decreases compared to commercial thermal pads (decreased: ΔT = 8.6 °C). These results demonstrate that the surface modified @VInGr composite thermal pad has pioneered a new TIM for effective thermal management in modern high-power electronics.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":"58 ","pages":"Article 102518"},"PeriodicalIF":6.5000,"publicationDate":"2025-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Composites Communications","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2452213925002712","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COMPOSITES","Score":null,"Total":0}
引用次数: 0
Abstract
In recent years, with the increasing integration level of modern electronics and the rise of artificial intelligence (AI) models, the development of advanced thermal interface materials (TIMs) for heat dissipation in high-power chips has become indispensable. Here in this work, based on the intrinsic high thermal conductivity of graphite and indium, the densely aligned vertical indium/graphite (@VInGr) thermal pad is prepared. The @VInGr exhibites a high through plane thermal conductivity (κ⊥ of 103.6 W/m·K) and low compression modulus (1.45 Mpa). Based on the excellent wettability of liquid metal (LM) on indium, we performed surface modification to reduce the thermal resistance and further improve heat dissipation efficiency. As a result, due to the formation of a ‘solid-liquid’ interface bridge, the total thermal resistance (Rtotal) decreased from 0.58 cm2 K/W to 0.38 cm2 K/W. Practical heat dissipation tests shows that when LM/@VInGr/LM is used as a thermal interface material (TIM), the temperature of LED bulb significantly decreases compared to commercial thermal pads (decreased: ΔT = 8.6 °C). These results demonstrate that the surface modified @VInGr composite thermal pad has pioneered a new TIM for effective thermal management in modern high-power electronics.
期刊介绍:
Composites Communications (Compos. Commun.) is a peer-reviewed journal publishing short communications and letters on the latest advances in composites science and technology. With a rapid review and publication process, its goal is to disseminate new knowledge promptly within the composites community. The journal welcomes manuscripts presenting creative concepts and new findings in design, state-of-the-art approaches in processing, synthesis, characterization, and mechanics modeling. In addition to traditional fiber-/particulate-reinforced engineering composites, it encourages submissions on composites with exceptional physical, mechanical, and fracture properties, as well as those with unique functions and significant application potential. This includes biomimetic and bio-inspired composites for biomedical applications, functional nano-composites for thermal management and energy applications, and composites designed for extreme service environments.