History and the Latest Progress in Antenna Packaging Technology: Part 1: Multilayer solutions

IF 5.7 4区计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Antennas and Propagation Magazine Pub Date : 2025-03-01 DOI:10.1109/MAP.2025.3560852

Seung Yoon Lee;Dongseop Lee;Yueping Zhang;Wonbin Hong;Nima Ghalichechian

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引用次数: 0

Abstract

The demand for millimeter-wave (mmWave) bands is growing due to the need for high-throughput communications, high-resolution sensing, and data-intensive applications such as massive Internet of Things (IoT), virtual reality, augmented reality, and metaverse platforms. Designing antennas for mmWave bands, unlike traditional microwave bands, requires multidimensional considerations such as antenna design methodologies, appropriate material selection, high-performance packaging technologies, and integration with surrounding circuitry. Antenna-in-package (AiP), which integrates transceiver (TRX) dies and antennas into a standard surface-mount package, effectively leverages advanced antenna engineering and heterogeneous integration processes. Codesigned with silicon integrated circuits (ICs) and built on the same silicon dies, antenna-on-chip (AoC) benefits significantly from frequency increases into the terahertz (THz) range. AoC takes advantage of silicon’s low surface roughness and monolithic integration to effectively incorporate antennas alongside peripheral ICs. Glass technology is emerging as a strong candidate for large-volume high-performance applications due to its low dielectric loss, similar thermal expansion coefficient to silicon, large-area panel/wafer size, and low surface roughness. Glass core AiP, which utilizes the low dielectric loss of glass, and antenna-on-display (AoD), which exploits the optical transparency of glass, are both promising concepts for 5G/6G mmWave applications. In this two-part article, we provide a comprehensive overview of antennas in packaging technologies in the mmWave band. In Part 1, we investigate design methodologies and features from different perspectives: material (organic or inorganic) and application [base station (BS) or user mobile terminal (UMT)]. We also review the historical development of multilayer antenna packaging. We then discuss the packaging integration of antenna arrays and radio-frequency ICs (RFICs), which are silicon-based phased-array systems. In Part 2, we focus on emerging techniques for antenna packaging, such as silicon, glass, and 3D integration.

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天线封装技术的历史与最新进展：第一部分：多层封装解决方案

由于需要高通量通信，高分辨率传感和数据密集型应用（如大规模物联网（IoT），虚拟现实，增强现实和元宇宙平台），对毫米波（mmWave）频段的需求正在增长。与传统微波频段不同，毫米波频段天线的设计需要多方面的考虑，如天线设计方法、合适的材料选择、高性能封装技术以及与周围电路的集成。封装天线（AiP）将收发器（TRX）芯片和天线集成到一个标准的表面贴装封装中，有效地利用了先进的天线工程和异构集成工艺。与硅集成电路（ic）共同设计并构建在相同的硅模具上，天线片（AoC）从频率增加到太赫兹（THz）范围中受益匪浅。AoC利用硅的低表面粗糙度和单片集成来有效地将天线与外围ic结合在一起。由于其介电损耗低、与硅相似的热膨胀系数、大面积面板/晶圆尺寸和低表面粗糙度，玻璃技术正成为大容量高性能应用的有力候选者。利用玻璃低介质损耗的玻璃芯AiP和利用玻璃光学透明度的天线显示（AoD）都是5G/6G毫米波应用的有前途的概念。在这篇由两部分组成的文章中，我们提供了毫米波频段中天线封装技术的全面概述。在第一部分中，我们从不同的角度研究设计方法和特征：材料（有机或无机）和应用[基站（BS）或用户移动终端（UMT）]。我们还回顾了多层天线封装的历史发展。然后我们讨论了天线阵列和射频集成电路（rfic）的封装集成，它们是硅基相控阵系统。在第2部分中，我们将重点介绍天线封装的新兴技术，如硅、玻璃和3D集成。

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来源期刊

IEEE Antennas and Propagation Magazine 工程技术-工程：电子与电气

CiteScore

7.00

自引率

5.70%

发文量

186

审稿时长

3 months

期刊介绍： IEEE Antennas and Propagation Magazine actively solicits feature articles that describe engineering activities taking place in industry, government, and universities. All feature articles are subject to peer review. Emphasis is placed on providing the reader with a general understanding of either a particular subject or of the technical challenges being addressed by various organizations, as well as their capabilities to cope with these challenges. Articles presenting new results, review, tutorial, and historical articles are welcome, as are articles describing examples of good engineering. The technical field of interest of the Magazine is the same as the IEEE Antennas and Propagation Society, and includes the following: antennas, including analysis, design, development, measurement, and testing; radiation, propagation, and the interaction of electromagnetic waves with discrete and continuous media; and applications and systems pertinent to antennas, propagation, and sensing, such as applied optics, millimeter- and sub-millimeter-wave techniques, antenna signal processing and control, radio astronomy, and propagation and radiation aspects of terrestrial and space-based communication, including wireless, mobile, satellite, and telecommunications.