Influence of height difference on thermal performance and flow stability of loop thermosyphon equipped with vertically placed flat evaporator for IGBT module cooling
Hengxuan Xu , Xiangji Guo , Shaowei Yang , Fengyi Tang , Bo Zhang , Kang Wang
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引用次数: 0
Abstract
This study presents a comprehensive experimental investigation into the thermal-hydraulic performance and flow dynamics of a loop thermosyphon system incorporating a vertically oriented flat evaporator designed for insulated gate bipolar transistor (IGBT) module cooling. The effects of critical operational parameters, namely liquid filling ratio (31 %–92 %), heat load (100–900 W), and height difference between evaporator and condenser (0 cm, 20 cm, 40 cm, and 60 cm), on heat transfer characteristics, temperature uniformity, and start-up behavior were systematically examined. Results reveal that increasing the height difference enhances the gravitational driving force, thereby expanding the operational heat load range and reducing the average evaporator temperature; however, it concurrently exacerbates temperature non-uniformity due to complex two-phase flow instabilities. Notably, an optimal filling ratio near 73 % was identified at zero height difference, where the system exhibits heightened sensitivity to filling variations and limited natural circulation capability. Detailed pressure measurements elucidate the interplay between liquid column height and flow resistance, highlighting a saturation phenomenon in driving pressure at elevated heat loads. The study further uncovers transient gas blockage during start-up, manifesting as short-lived dry-up and temperature oscillations, which detrimentally affect system stability. These phenomena are attributed to the coupled effects of liquid film dynamics, bubble behavior, and gravitational forces within the confined geometry of the flat evaporator. The findings provide critical insights into the underlying physical mechanisms governing loop thermosyphon operation with flat evaporators and offer practical guidelines for optimizing design parameters to achieve enhanced thermal management of high-power electronic devices.
期刊介绍:
The International Journal of Thermal Sciences is a journal devoted to the publication of fundamental studies on the physics of transfer processes in general, with an emphasis on thermal aspects and also applied research on various processes, energy systems and the environment. Articles are published in English and French, and are subject to peer review.
The fundamental subjects considered within the scope of the journal are:
* Heat and relevant mass transfer at all scales (nano, micro and macro) and in all types of material (heterogeneous, composites, biological,...) and fluid flow
* Forced, natural or mixed convection in reactive or non-reactive media
* Single or multi–phase fluid flow with or without phase change
* Near–and far–field radiative heat transfer
* Combined modes of heat transfer in complex systems (for example, plasmas, biological, geological,...)
* Multiscale modelling
The applied research topics include:
* Heat exchangers, heat pipes, cooling processes
* Transport phenomena taking place in industrial processes (chemical, food and agricultural, metallurgical, space and aeronautical, automobile industries)
* Nano–and micro–technology for energy, space, biosystems and devices
* Heat transport analysis in advanced systems
* Impact of energy–related processes on environment, and emerging energy systems
The study of thermophysical properties of materials and fluids, thermal measurement techniques, inverse methods, and the developments of experimental methods are within the scope of the International Journal of Thermal Sciences which also covers the modelling, and numerical methods applied to thermal transfer.