{"title":"Low Turn-on Voltage Fully Vertical GaN-on-SiC PiN Diodes achieved by Recovering GaN Surface","authors":"Yufei Yang, Yuxia Feng, Wenkang Mei, Maojun Wang, Xun Zhang, Tengxuan Ma, Xuelin Yang, Bo Shen","doi":"10.1016/j.jallcom.2025.181911","DOIUrl":null,"url":null,"abstract":"This work reports the achievement of a low turn-on voltage fully vertical GaN-on-SiC PiN diode by recovering GaN surface. The surface recovery approach is highly compatible with the existing fabrication process of GaN/SiC hybrid devices. This approach involves reduction and recovery of nitrogen vacancies on GaN surface, realizing directly by the high-temperature annealing for the formation of SiC Ohmic contact in NH<ce:inf loc=\"post\">3</ce:inf>/N<ce:inf loc=\"post\">2</ce:inf> atmosphere. Transmission Line Model measurements indicate that the current after GaN surface recovery demonstrates improved Ohmic characteristics, closely resembling that of an undamaged state. By implementing this annealing process, the turn-on voltage of fully vertical GaN-on-SiC PiN diodes is reduced to 2.7<ce:hsp sp=\"0.25\"></ce:hsp>V.","PeriodicalId":344,"journal":{"name":"Journal of Alloys and Compounds","volume":"271 1","pages":""},"PeriodicalIF":6.3000,"publicationDate":"2025-06-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Alloys and Compounds","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/j.jallcom.2025.181911","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
This work reports the achievement of a low turn-on voltage fully vertical GaN-on-SiC PiN diode by recovering GaN surface. The surface recovery approach is highly compatible with the existing fabrication process of GaN/SiC hybrid devices. This approach involves reduction and recovery of nitrogen vacancies on GaN surface, realizing directly by the high-temperature annealing for the formation of SiC Ohmic contact in NH3/N2 atmosphere. Transmission Line Model measurements indicate that the current after GaN surface recovery demonstrates improved Ohmic characteristics, closely resembling that of an undamaged state. By implementing this annealing process, the turn-on voltage of fully vertical GaN-on-SiC PiN diodes is reduced to 2.7V.
期刊介绍:
The Journal of Alloys and Compounds is intended to serve as an international medium for the publication of work on solid materials comprising compounds as well as alloys. Its great strength lies in the diversity of discipline which it encompasses, drawing together results from materials science, solid-state chemistry and physics.