Weixiu Shi , Haiyu Chang , Xuebing Liu , Lisheng Pan
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引用次数: 0
Abstract
The excessive emission of particulate matter and the waste of residual heat are major issues in the flue gas emission process. By arranging perpendicular pipe turbulence heat exchange devices in the flue gas, it is possible to achieve flue gas heat recovery and fine particles agglomeration during water vapor phase change process. A numerical calculation model of the particle agglomeration process was established, involving turbulent agglomeration, Brownian agglomeration and vapor phase-change agglomeration. The influence of flue gas particle concentration, flue gas temperature, flue gas flow rate, flue gas humidity, heat exchange device wall temperature and structure on the agglomeration of particles was studied. The results indicate that an increase in particle concentration can enhance agglomeration efficiency, while excessively large or small particle sizes can reduce this efficiency. A decrease in flow velocity provides particles with more residence time within the heat exchanger, thereby improving agglomeration efficiency. A drop in flue gas temperature weakens convective heat transfer and vapor-phase condensation, leading to decreased agglomeration efficiency. Condensation of water vapor on particle surfaces promotes particle agglomeration efficiency. Lower wall temperatures and higher water vapor volume fractions increase the amount of vapor condensation, leading to more particles agglomeration under the influence of condensation. The use of staggered arrangements in the structure also helps improve particle agglomeration efficiency.
期刊介绍:
Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application.
The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.