Application of ohmic and vacuum-assisted ohmic heating technologies for proofing composite millet-based doughs: Assessment of techno-functional properties, rheological behavior, and modeling of proofing kinetics

IF 5.8 2区 农林科学 Q1 ENGINEERING, CHEMICAL
Arpan Dubey, Punyadarshini Punam Tripathy
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Abstract

This study presents a comprehensive investigation into the techno-functional properties, rheological behaviors, and the application of ohmic heating (OH) and vacuum-assisted ohmic heating (VAOH) as novel proofing techniques for composite millet-based bread doughs. Composite millet flours (CMF) were obtained by substituting refined wheat flour (RWF) with 20, 40, and 60% (w/w) mixed millet flour (finger and kodo millet flours in 1:1 ratio). Techno-functional and color attributes of flours were analyzed along with rheological characterization of the respective doughs. Furthermore, conventional proofing (35 °C), OH proofing (10, 15, 20, 25, and variable V), and VAOH proofing (20, 40, and 60 kPa) were performed. Expansion ratio (ER) obtained during proofing was fitted to the Gompertz model, demonstrating high accuracy (R2: 0.96–0.99). An increment in storage and loss modulus was observed with increasing millet content in the doughs. Stress relaxation test unveiled that doughs with higher millet substitution presented a greater resistance to deformation. Conventional proofing resulted in lower ER particularly for CMF doughs. OH proofing significantly (p < 0.05) reduced the time lag (tlag) and improved expansion with increasing voltage. However, maintaining temperature homogeneity near 35 °C at higher voltages was challenging, so a voltage-time combination (variable V) was devised. For further improvement, VAOH proofing was performed that resulted in a 42.80% and 45.33% reduction in tlag at 40 kPa (with variable V) for 40% and 60% CMF doughs, respectively, compared to OH proofing at variable V. This technological approach demonstrated scalable potential for improving proofing dynamics in composite millet-based dough systems.
欧姆和真空辅助欧姆加热技术在复合米基面团打样中的应用:技术功能特性评估、流变行为和打样动力学建模
本研究全面研究了欧姆加热(OH)和真空辅助欧姆加热(VAOH)作为复合面包面团的新打样技术的技术功能特性、流变行为以及应用。用20%、40%和60% (w/w)的混合小米粉(指粉和科多粉)以1:1的比例代替精制小麦粉,制得复合小米粉。分析了面粉的工艺功能属性和颜色属性,并对不同面团进行了流变学表征。此外,还进行了常规打样(35°C)、OH打样(10、15、20、25和可变V)和VAOH打样(20、40和60 kPa)。在打样过程中得到的膨胀比(ER)与Gompertz模型拟合,具有较高的精度(R2: 0.96-0.99)。随着面团中谷子含量的增加,其贮藏模量和损耗模量也随之增加。应力松弛试验表明,谷子替代量高的面团具有更强的抗变形能力。常规打样导致较低的ER,特别是对于CMF面团。OH防护显著(p <;0.05)减小了时间滞后(滞后),并随着电压的增加提高了膨胀率。然而,在较高电压下保持35°C附近的温度均匀性是具有挑战性的,因此设计了电压-时间组合(可变V)。为了进一步改进,对40%和60%的CMF面团进行了VAOH打样,与在可变V下进行的OH打样相比,在40 kPa(可变V)下,对40%和60%的CMF面团进行了VAOH打样,分别使标记减少了42.80%和45.33%。这种技术方法证明了在复合面团体系中改善打样动力学的可扩展潜力。
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来源期刊
Journal of Food Engineering
Journal of Food Engineering 工程技术-工程:化工
CiteScore
11.80
自引率
5.50%
发文量
275
审稿时长
24 days
期刊介绍: The journal publishes original research and review papers on any subject at the interface between food and engineering, particularly those of relevance to industry, including: Engineering properties of foods, food physics and physical chemistry; processing, measurement, control, packaging, storage and distribution; engineering aspects of the design and production of novel foods and of food service and catering; design and operation of food processes, plant and equipment; economics of food engineering, including the economics of alternative processes. Accounts of food engineering achievements are of particular value.
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