XiaoHui Wang, MuJun Li, Yang Jiang, KangYao Wen, ChuYing Tang, FangZhou Du, Chun-Zhang Chen, ChenKai Deng, Yi Zhang, HongHao Lu, YiFan Cui, Qing Wang, HongYu Yu
{"title":"2.86-kV Vertical Cu2O/Ga2O3 Heterojunction Diodes with Stepped Double-layer Structure","authors":"XiaoHui Wang, MuJun Li, Yang Jiang, KangYao Wen, ChuYing Tang, FangZhou Du, Chun-Zhang Chen, ChenKai Deng, Yi Zhang, HongHao Lu, YiFan Cui, Qing Wang, HongYu Yu","doi":"10.1016/j.jallcom.2025.181672","DOIUrl":null,"url":null,"abstract":"High-performance Cu<ce:inf loc=\"post\">2</ce:inf>O/β-Ga<ce:inf loc=\"post\">2</ce:inf>O<ce:inf loc=\"post\">3</ce:inf> heterojunction diodes (HJDs) with a notable breakdown voltage of 2860<ce:hsp sp=\"0.25\"></ce:hsp>V were achieved by employing a stepped double-layer (SDL) structure of Cu<ce:inf loc=\"post\">2</ce:inf>O. The device exhibits a turn-on voltage of 1.2<ce:hsp sp=\"0.25\"></ce:hsp>V, a specific on-resistance of 8.1 mΩ·cm<ce:sup loc=\"post\">2</ce:sup>, and a power figure-of-merit exceeding 1.0<ce:hsp sp=\"0.25\"></ce:hsp>GW/cm<ce:sup loc=\"post\">2</ce:sup>. Additionally, the HJD-SDL demonstrates consistent thermal stability, operating normally at temperatures up to 473<ce:hsp sp=\"0.25\"></ce:hsp>K. Simulation results indicate that the SDL structure, consisting of a p<ce:sup loc=\"post\">+</ce:sup> Cu<ce:inf loc=\"post\">2</ce:inf>O/p<ce:sup loc=\"post\">-</ce:sup> Cu<ce:inf loc=\"post\">2</ce:inf>O structure, significantly enhances breakdown performance by effectively suppressing the peak electric field and redistributing it within the device bulk. The temperature-dependent I–V analysis reveals the variations in electrical performance parameters underlying the forward conduction mechanism. The interface trap density at Cu<ce:inf loc=\"post\">2</ce:inf>O/Ga<ce:inf loc=\"post\">2</ce:inf>O<ce:inf loc=\"post\">3</ce:inf> heterojunction is determined through frequency-dependent capacitance and conductance measurements. These findings provide a promising and effective strategy for the development of Ga<ce:inf loc=\"post\">2</ce:inf>O<ce:inf loc=\"post\">3</ce:inf> bipolar power electronics.","PeriodicalId":344,"journal":{"name":"Journal of Alloys and Compounds","volume":"10 1","pages":""},"PeriodicalIF":5.8000,"publicationDate":"2025-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Alloys and Compounds","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/j.jallcom.2025.181672","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
High-performance Cu2O/β-Ga2O3 heterojunction diodes (HJDs) with a notable breakdown voltage of 2860V were achieved by employing a stepped double-layer (SDL) structure of Cu2O. The device exhibits a turn-on voltage of 1.2V, a specific on-resistance of 8.1 mΩ·cm2, and a power figure-of-merit exceeding 1.0GW/cm2. Additionally, the HJD-SDL demonstrates consistent thermal stability, operating normally at temperatures up to 473K. Simulation results indicate that the SDL structure, consisting of a p+ Cu2O/p- Cu2O structure, significantly enhances breakdown performance by effectively suppressing the peak electric field and redistributing it within the device bulk. The temperature-dependent I–V analysis reveals the variations in electrical performance parameters underlying the forward conduction mechanism. The interface trap density at Cu2O/Ga2O3 heterojunction is determined through frequency-dependent capacitance and conductance measurements. These findings provide a promising and effective strategy for the development of Ga2O3 bipolar power electronics.
期刊介绍:
The Journal of Alloys and Compounds is intended to serve as an international medium for the publication of work on solid materials comprising compounds as well as alloys. Its great strength lies in the diversity of discipline which it encompasses, drawing together results from materials science, solid-state chemistry and physics.